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CORC

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Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang
收藏  |  浏览/下载：15/0  |  提交时间：2022/08/09
Interfacial reactions at Ga-21.5In-10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2022, 卷号: 282, 页码: 16
作者:  Gao, Zhaoqing;  Wang, Chen;  Chai, Zhenbang;  Chen, Yinbo;  Shen, Chenyu
收藏  |  浏览/下载：23/0  |  提交时间：2022/07/14
Wetting of substoichiometric YSZ2-x by molten Sn-based active alloys at 800–900 °C 期刊论文
Ceramics International, 2022, 卷号: 48, 期号: 20, 页码: 30621-30629
作者:  Sui, Ran;  Tan, Kaihui;  Lin, Qiaoli;  Xie, Kaibin
收藏  |  浏览/下载：18/0  |  提交时间：2022/08/09
Wetting of YSZ by molten Sn-8Zr, Sn-4Zr-4Ti, and Sn-8Ti alloys at 800-900 degrees C 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 1, 页码: 373-380
作者:  Lin, Qiaoli;  Tan, Kaihui;  Wang, Le;  Sui, Ran
收藏  |  浏览/下载：20/0  |  提交时间：2022/03/01
Effect of Electric Field on the Microstructure and Properties of Brazed Joints of Float Glass and Kovar 4J29 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2021, 卷号: 50, 期号: 11, 页码: 4003-4009
作者:  Yu Weiyuan;  Yang Guoqing;  Sun Xuemin;  Wang Fengfeng;  Zhang Tao
收藏  |  浏览/下载：9/0  |  提交时间：2022/03/01
Comparative study on wetting of smooth and rough silica surface by molten Sn-3.5Ag-2Ti alloys 期刊论文
CERAMICS INTERNATIONAL, 2021, 卷号: 47, 期号: 20, 页码: 29205-29212
作者:  Lin, Qiaoli;  Wang, Chaopeng;  Xie, Kaibin;  Wang, Le;  Sui, Ran
收藏  |  浏览/下载：25/0  |  提交时间：2021/10/14
Comparative study on wetting of smooth and rough silica surface by molten Sn–3.5Ag–2Ti alloys 期刊论文
Ceramics International, 2021, 卷号: 47, 期号: 20, 页码: 29205-29212
作者:  Lin, Qiaoli;  Wang, Chaopeng;  Xie, Kaibin;  Wang, Le;  Sui, Ran
收藏  |  浏览/下载：21/0  |  提交时间：2022/02/17
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong
收藏  |  浏览/下载：2/0  |  提交时间：2022/02/17
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong
收藏  |  浏览/下载：8/0  |  提交时间：2020/11/14
Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly 期刊论文
ACTA METALLURGICA SINICA, 2020, 卷号: 56, 期号: 10, 页码: 1433-1440
作者:  Jiang Lin;  Zhang Liang;  Liu Zhiquan
收藏  |  浏览/下载：36/0  |  提交时间：2021/02/02

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