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CORC

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Optical transceiver by fowlp and dop multichip integration 专利
专利号: US20170254968A1, 申请日期: 2017-09-07, 公开日期: 2017-09-07
作者:  DING, LIANG;  NAGARAJAN, RADHAKRISHNAN L.;  COCCIOLI, ROBERTO
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/30
Numerical Modeling and Dynamic Characteristics of Thermal and Mass Transport in Solder joints during Laser soldering 项目
2017-
作者:  ANIL KUNWAR
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 4, 页码: -
Zhang, Liang; Liu, Zhi-quan; Yang, Fan; Zhong, Su-juan
收藏  |  浏览/下载：22/0  |  提交时间：2017/08/17
原位焊接型单次试开密码鉴别电路 期刊论文
探测与控制学报, 2017, 卷号: 39, 期号: 1, 页码: 93-95，100
作者:  贾乐;  王宇航;  高杨
收藏  |  浏览/下载：5/0  |  提交时间：2019/08/27
Ultrasound-assisted soldering of Cu alloy using a Ni-foam reinforced Sn composite solder 会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017
作者:  Wang, Qiwei;  Xiao, Yong*;  Zhang, Xingyi
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/04
Ultrasound-assisted soldering of alumina using Ni-foam reinforced Sn-based composite solders 期刊论文
Ceramics International, 2017, 卷号: 43, 期号: 16, 页码: 14314-14320
作者:  Xiao, Yong;  Zhang, Yuanqi;  Zhao, Kai;  Li, Shan;  Wang, Ling
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/04
原位焊接型单次试开密码鉴别电路 In-situ Soldering Type Single-try Discriminator Circuit 期刊论文
2017, 卷号: 39, 页码: 93-95
作者:  贾乐[1];  高杨[2,3];  王宇航[1,4]
收藏  |  浏览/下载：3/0  |  提交时间：2019/11/30
Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Under Thermomigration 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 页码: 1931-1936
作者:  Zhao, N.;  Deng, J. F.;  Zhong, Y.;  Huang, M. L.;  Ma, H. T.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid-solid interface during soldering cooling stage 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 卷号: 28, 页码: 5398-5406
作者:  Guo, Bingfeng;  Ma, Haitao;  Jiang, Chengrong;  Wang, Yunpeng;  Kunwar, Anil
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Chen, Jun;  Zhao, Ning
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03

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