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科研机构
兰州理工大学 [28]
内容类型
期刊论文 [28]
发表日期
2022 [3]
2021 [3]
2020 [8]
2019 [8]
2018 [6]
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专题:兰州理工大学
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Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:
Yu, Weiyuan
;
Li, Binbin
;
Wu, Baolei
;
Wang, Fengfeng
;
Wang, Mingkang
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2022/08/09
Binary alloys
Copper
Copper alloys
Indium alloys
Lead-free solders
Microstructure
Shear flow
Silicon carbide
Soldering
Temperature
Thermoelectric equipment
Wide band gap semiconductors
Composite solders
Electronics devices
In-45cu composite solder paste
Intermetallics compounds
Microstructures and mechanical properties
Service temperature
Shears strength
Solderpaste
Ultrasonic action time
Ultrasonic-assisted TLP
Wetting of substoichiometric YSZ2-x by molten Sn-based active alloys at 800–900 °C
期刊论文
Ceramics International, 2022, 卷号: 48, 期号: 20, 页码: 30621-30629
作者:
Sui, Ran
;
Tan, Kaihui
;
Lin, Qiaoli
;
Xie, Kaibin
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2022/08/09
Activation analysis
Activation energy
Binary alloys
Bond strength (chemical)
Brazing
Diffusion bonding
Phase interfaces
Tin alloys
Yttria stabilized zirconia
Yttrium oxide
Zircaloy
Dissolutive wetting
Interface formation
Liquid/solid interface
Metallicities
Modified sessile drop method
Non-metallic
Soldering
Titania
Yttria-stabilized
Zirconia substrates
Wetting of YSZ by molten Sn-8Zr, Sn-4Zr-4Ti, and Sn-8Ti alloys at 800-900 degrees C
期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 1, 页码: 373-380
作者:
Lin, Qiaoli
;
Tan, Kaihui
;
Wang, Le
;
Sui, Ran
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2022/03/01
Wettability
Soldering
Spreading dynamics
Effect of Electric Field on the Microstructure and Properties of Brazed Joints of Float Glass and Kovar 4J29
期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2021, 卷号: 50, 期号: 11, 页码: 4003-4009
作者:
Yu Weiyuan
;
Yang Guoqing
;
Sun Xuemin
;
Wang Fengfeng
;
Zhang Tao
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2022/03/01
ALTSAB
anodic bonding
soldering
float glass
Kovar
Comparative study on wetting of smooth and rough silica surface by molten Sn-3.5Ag-2Ti alloys
期刊论文
CERAMICS INTERNATIONAL, 2021, 卷号: 47, 期号: 20, 页码: 29205-29212
作者:
Lin, Qiaoli
;
Wang, Chaopeng
;
Xie, Kaibin
;
Wang, Le
;
Sui, Ran
收藏
  |  
浏览/下载:25/0
  |  
提交时间:2021/10/14
Wettability
Roughness
Soldering
Spreading dynamics
Comparative study on wetting of smooth and rough silica surface by molten Sn–3.5Ag–2Ti alloys
期刊论文
Ceramics International, 2021, 卷号: 47, 期号: 20, 页码: 29205-29212
作者:
Lin, Qiaoli
;
Wang, Chaopeng
;
Xie, Kaibin
;
Wang, Le
;
Sui, Ran
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2022/02/17
Silica
Soldering
Wetting
Comparatives studies
Highest temperature
Interfacial roughness
Non linear
Reactive wetting
Rough surfaces
Silica surface
Sn-3.5Ag
Spreading dynamics
Wetting behavior
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin
期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Yanhong
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2022/02/17
Activation energy
Copper
Liquids
Microelectronics
Soldering
Thermal gradients
Tin
Ultrasonics
Copper dissolution
Development trends
Dissolution kinetics
Dissolution rates
Enhanced dissolutions
Microelectronic products
Multifunctionality
Sound pressure distribution
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin
期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Yanhong
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2020/11/14
Activation energy
Copper
Liquids
Microelectronics
Soldering
Thermal gradients
Tin
Ultrasonics
Copper dissolution
Development trends
Dissolution kinetics
Dissolution rates
Enhanced dissolutions
Microelectronic products
Multifunctionality
Sound pressure distribution
Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints
期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729
作者:
Cheng, Jinxuan
;
Hu, Xiaowu
;
Li, Qinglin
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2020/11/14
Bismuth compounds
Diffusion barriers
Gold
Gold compounds
Heat resistance
Microstructure
Nickel
Open circuit voltage
Soldering
Barrier films
Diffusion barrier films
Electrical resistances
Output current
Reflow--soldering
Solder joints
Temperature differences
Thermoelectric
Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints
期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 14, 页码: 11470-11481
作者:
Cheng, Jinxuan
;
Hu, Xiaowu
;
Zhang, Zhe
;
Li, Qinglin
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2020/11/14
Binary alloys
Diffusion
Growth rate
Soldering
Atomic diffusions
Compound layer
Diffusion channels
Diffusion process
Micro-structure evolutions
Plating thickness
Solder joint reliability
Solder joints
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