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浏览/检索结果: 共67条，第1-10条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints (EI收录) 期刊论文 Journal of Alloys and Compounds, 2017, 卷号: 719, 页码: 365-375 作者:  Tang, Y.[1];  Luo, S.M.[1];  Huang, W.F.[1];  Pan, Y.C.[2];  Li, G.Y.[2] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/24 Brittle fracture  Copper alloys  Ductile fracture  Fracture  Intermetallics  Lead  free solders  Manganese  Nanoparticles  Scanning electron microscopy  Silver  Silver alloys  Soldered joints  Soldering alloys  Strain rate  Tensile properties  Tensile testing  Tin  Tin alloys   Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/ SiO2joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler (EI收录) 期刊论文 Materials Science and Engineering A, 2017, 卷号: 680, 页码: 317-323 作者:  Cheng, L.X.[1];  Liu, M.R.[2];  Wang, X.Q.[3];  Yan, B.H.[1];  Li, G.Y.[4] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/24 Bonding  Cerium alloys  Chemical bonds  Fracture  Gallium  Gallium alloys  Interfaces (materials)  Intermetallics  Low temperature engineering  Microstructure  Silica  Silicon oxides  Soldering  Substrates  Temperature  Thermodynamics  Titanium   Effect of Nano-TiO2particles on growth of interfacial Cu6Sn5and Cu3Sn layers in Sn-3.0Ag-0.5Cu-xTiO2solder joints (EI收录SCI收录) 期刊论文 Journal of Alloys and Compounds, 2016, 卷号: 684, 页码: 299-309 作者:  Tang, Y.[1];  Luo, S.M.[1];  Wang, K.Q.[1];  Li, G.Y.[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 Activation energy  Chemical activation  Copper compounds  Diffusion  Energy dispersive spectroscopy  Grain boundaries  Grain growth  Intermetallics  Lead  free solders  Scanning electron microscopy  Silver  Soldered joints  Soldering alloys  Titanium dioxide  X ray diffraction  X ray spectroscopy   Influence of TiO2 nanoparticles on thermal property, wettability and interfacial reaction in Sn-3.0Ag-0.5Cu-xTiO2 composite solder (EI收录SCI收录) 期刊论文 Journal of Materials Science: Materials in Electronics, 2013, 卷号: 24, 页码: 1587-1594 作者:  Tang, Y.[1,2];  Pan, Y.C.[1];  Li, G.Y.[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/25 Adsorption  Microstructure  Nanoparticles  Scanning electron microscopy  Silver  Soldered joints  Soldering alloys  Thermodynamic properties  Titanium dioxide  Wetting  X ray diffraction analysis   Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints in reflow process (EI收录SCI收录) 期刊论文 Journal of Alloys and Compounds, 2013, 卷号: 554, 页码: 195-203 作者:  Tang, Y.[1,2];  Li, G.Y.[1];  Pan, Y.C.[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/25 Adsorption  Curve fitting  Energy dispersive spectroscopy  Grain growth  Grain size and shape  Growth kinetics  Intermetallics  Kinetics  Nanoparticles  Ostwald ripening  Reaction kinetics  Scanning electron microscopy  Soldered joints  Soldering  Soldering alloys  Tin  Titanium dioxide  X ray diffraction analysis   Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process (EI收录) 期刊论文 Journal of Materials Science: Materials in Electronics, 2012, 卷号: 23, 页码: 1543-1551 作者:  Zhou, M.B.[1];  Ma, X.[1];  Zhang, X.P.[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/26 Differential scanning calorimetry  Flip chip devices  Interface states  Intermetallics  Liquids  Phase interfaces  Soldering alloys  Tin   Creep fracture behaviour of joints soldered by a nano-composite solder, lead-free and conventional tin-lead solders (EI收录) 会议论文 11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005 作者:  Zhang, X.P.[1,2];  Shi, Y.W.[3];  Mai, Y.W.[1];  Shrestha, S.[4];  Dorn, L.[4] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/18 Creep  Creep resistance  Fractography  Fracture  Fracture mechanics  Lead  Microelectronics  Nanocomposites  Particle reinforced composites  Silver  Silver alloys  Soldering alloys  Textures   An Automatic Chip Character Checking System for Circuit Board Quality Control (EI收录) 会议论文 IECON Proceedings (Industrial Electronics Conference), Roanoke, VA, United states, November 2, 2003 - November 6, 2003 作者:  Wang, Zhiyan[1];  Li, Yunjie[1];  Luo, Zhimin[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/19 Algorithms  Backpropagation  Image processing  Interpolation  Microprocessor chips  Neural networks  Optical character recognition  Pattern recognition systems  Quality control  Soldering   Processing treatment of a lead-free Sn-Ag-Cu-Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection (EI收录) 会议论文 Journal of Materials Processing Technology, Singapore, Singapore, December 4, 2006 - December 6, 2006 作者:  Zhang, X.P.[1];  Yu, C.B.[1];  Zhang, Y.P.[1];  Shrestha, S.[2];  Dorn, L.[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/17 Creep  Laser beams  Lead  Silver  Soldering alloys  Tin alloys   Effect of dopant on microstructure and mechanical properties of Pb-free solder joints (EI收录) 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, Shanghai, China, August 14, 2007 - August 17, 2007 作者:  Li, G.Y.[1] 收藏  |  浏览/下载：17/0  |  提交时间：2019/04/17 Activation energy  Alloys  Brazing  Copper  Copper alloys  Electronics packaging  Lead  Mechanical properties  Semiconducting intermetallics  Silver  Silver alloys  Soldering alloys  Technology  Tin alloys  Welding