Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP

doi:10.1016/j.microrel.2022.114600

	Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
	Yu, Weiyuan 1,2; Li, Binbin 1,2; Wu, Baolei 1,2; Wang, Fengfeng 1,2; Wang, Mingkang 1,2
刊名	Microelectronics Reliability
	2022-08-01
卷号	135
关键词	Binary alloys Copper Copper alloys Indium alloys Lead-free solders Microstructure Shear flow Silicon carbide Soldering Temperature Thermoelectric equipment Wide band gap semiconductors Composite solders Electronics devices In-45cu composite solder paste Intermetallics compounds Microstructures and mechanical properties Service temperature Shears strength Solderpaste Ultrasonic action time Ultrasonic-assisted TLP
ISSN号	0026-2714
DOI	10.1016/j.microrel.2022.114600
英文摘要	With the application of the third-generation semiconductor SiC in high-power, high-current-density devices, the service temperature of electronic devices is getting higher and higher, and the traditional soldering materials and technologies are facing many technical problems, making it difficult to achieve the goal of "low-temperature connection and high-temperature service." In this paper, a new type of In[sbnd]45Cu composite solder paste was developed to address this problem, and all-Cu2In IMC can be obtained at a service temperature of 600 °C by using ultrasonic-assisted TLP at 260 °C. In this paper, the effects of ultrasonic action time on the microstructure evolution, shear strength, and growth mechanism of intermetallic compounds (IMCs) of the joints were investigated. The results showed that the cavitation effect and acoustic flow effect of ultrasound accelerated the reaction between liquid In and Cu particles, and when the ultrasound action time was 30 s, all In and Cu particles in the joint were transformed into Cu2In, and the shear strength of the joint was 19.69 MPa, at which time the joint was dense due to the expansion of the volume of Cu2In, which eliminated the voids caused by the volume shrinkage of Cu11In9, making it possible for the electronic device to serve for a long time at high temperature. © 2022 Elsevier Ltd
WOS研究方向	Engineering ; Science & Technology - Other Topics ; Physics
语种	英语
出版者	Elsevier Ltd
WOS记录号	WOS:000833593600004
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/159365]
专题	实验室建设与管理处
作者单位	1.State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metals, Lanzhou University of Technology, Gansu, Lanzhou; 730050, China; 2.School of Materials Science and Engineering, Lanzhou University of Technology, Gansu, Lanzhou; 730050, China
推荐引用方式 GB/T 7714	Yu, Weiyuan,Li, Binbin,Wu, Baolei,et al. Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP[J]. Microelectronics Reliability,2022,135.
APA	Yu, Weiyuan,Li, Binbin,Wu, Baolei,Wang, Fengfeng,&Wang, Mingkang.(2022).Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP.Microelectronics Reliability,135.
MLA	Yu, Weiyuan,et al."Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP".Microelectronics Reliability 135(2022).