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CORC

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Interfacial microstructure evolution of gold alloy/Sn-based solder under different thermal aging conditions 会议论文
2ND INTERNATIONAL WORKSHOP ON MATERIALS SCIENCE AND MECHANICAL ENGINEERING (IWMSME2018), 2019-01-01
作者:  Mu, G. Q.;  Qu, W. Q.;  Wu, Y. C.;  Zhuang, H. S.
收藏  |  浏览/下载：64/0  |  提交时间：2019/12/30
Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple reflows 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ma, Haoran;  Yao, Jinye;  Wang, Chen;  Shang, Shengyan;  Wang, Yunpeng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Effect of Soldering Sequences on Cu-Ni interaction in flip-chip interconnects 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Kuang, Jiameng;  Huang, Mingliang
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni solder joints 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Guo, Bingfeng;  Huang, Ru;  Yao, Jinye;  Qi, Xiao;  Kunwar, Anil
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Ultrasound-assisted soldering of Cu alloy using a Ni-foam reinforced Sn composite solder 会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017
作者:  Wang, Qiwei;  Xiao, Yong*;  Zhang, Xingyi
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/04
In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Chen, Jun;  Zhao, Ning
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering under temperature gradient 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03
Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes 会议论文
physics and simulation of optoelectronic devices xxv, san francisco, ca, united states, 2017-01-30
作者:  Zhang, Hongyou;  Liang, Xuejie;  Cai, Wanshao;  Zah, Chungen;  Liu, Xingsheng
收藏  |  浏览/下载：78/0  |  提交时间：2017/05/27
In situ study of real-time growth behavior of IMC morphology evolution during the Sn/Cu soldering cooling stage 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Zhao, Ning;  Ma, Haitao
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/09

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