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Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang
收藏  |  浏览/下载：15/0  |  提交时间：2022/08/09
Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder 期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302
作者:  Yu, Weiyuan;  Sun, Jungang;  Liu, Yun;  B., Wu;  Z., Lei
收藏  |  浏览/下载：8/0  |  提交时间：2022/02/17
Effects of aluminum addition (x = 0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文
Materials Research Express, 2019, 卷号: 6, 期号: 8
作者:  Li, Jiayin;  Hu, Xiaowu;  Zhang, Xudong;  Li, Qinglin
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14
Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 5, 页码: -
Yang, Fan; Zhang, Liang; Liu, Zhi-quan; Zhong, Su Juan; Ma, Jia; Bao, Li
收藏  |  浏览/下载：24/0  |  提交时间：2017/08/17
Ultrasound-assisted soldering of alumina using Ni-foam reinforced Sn-based composite solders 期刊论文
Ceramics International, 2017, 卷号: 43, 期号: 16, 页码: 14314-14320
作者:  Xiao, Yong;  Zhang, Yuanqi;  Zhao, Kai;  Li, Shan;  Wang, Ling
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/04
Wetting behavior in ultrasonic vibration-assisted brazing of aluminum to graphite using Sn-Ag-Ti active solder 期刊论文
Surface Review and Letters, 2015, 卷号: 22, 期号: 3
作者:  Yu, Wei-Yuan;  Liu, Sen-Hui;  Liu, Xin-Ya;  Shao, Jia-Lin;  Liu, Min-Pen
收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14
Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 卷号: 25, 页码: 328-337
作者:  Liu, Xiaoying;  Huang, Mingliang;  Zhao, Ning;  Wang, Lai
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/09
Dissolutive wetting process and interfacial characteristic of molten Sn-17Bi-0.5Cu alloy on copper substrate 期刊论文
稀有金属, 2013
Xu, Bing-Sheng; Zang, Li-Kun; Yuan, Zhang-Fu; Wu, Yan; Zhou, Zhou
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/10
Influence of minor POSS molecules additions on the microstructure and hardness of Sn3Ag0.5Cu-xPOSS composite solders 期刊论文
2012, 卷号: 23, 页码: 1640-1646
作者:  Shen, Jun[1];  Peng, Changfei[1];  Yin, Heng Gang[1];  Chen, Jie[1,2]
收藏  |  浏览/下载：1/0  |  提交时间：2019/11/28
Reactive Wetting Processes and Triple-Line Configuration of Sn-3.5Ag on Cu Substrates at Elevated Temperatures 期刊论文
journal of electronic materials, 2012
Zang, Likun; Yuan, Zhangfu; Cao, Zhanmin; Matsuura, Hiroyuki; Tsukihashi, Fumitaka
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/12

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