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CORC

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Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369
作者:  Huang, Ru;  Ma, Haoran;  Shang, Shengyan;  Kunwar, Anil;  Wang, Yunpeng
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Qu, Lin;  Ma, Haitao
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Effects of TiO2 nanoparticles addition on physical and soldering properties of Sn-xTiO(2) composite solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 18828-18837
作者:  Liu, Zhiyuan;  Ma, Haoran;  Shang, Shengyan;  Wang, Yunpeng;  Li, Xiaogan
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/02
Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint 期刊论文
MICROELECTRONIC ENGINEERING, 2019, 卷号: 208, 页码: 47-53
作者:  Shang, Shengyan;  Wang, Yanfeng;  Wang, Yunpeng;  Ma, Haitao;  Kunwar, Anil
收藏  |  浏览/下载：121/0  |  提交时间：2019/12/02
Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 15964-15971
作者:  Zhu, Zhidan;  Ma, Haoran;  Shang, Shengyan;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple reflows 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ma, Haoran;  Yao, Jinye;  Wang, Chen;  Shang, Shengyan;  Wang, Yunpeng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Effect of Soldering Sequences on Cu-Ni interaction in flip-chip interconnects 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Kuang, Jiameng;  Huang, Mingliang
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni solder joints 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Guo, Bingfeng;  Huang, Ru;  Yao, Jinye;  Qi, Xiao;  Kunwar, Anil
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints 期刊论文
MICROELECTRONICS RELIABILITY, 2018, 卷号: 80, 页码: 55-67
作者:  Kunwar, Anil;  Shang, Shengyan;  Raback, Peter;  Wang, Yunpeng;  Givernaud, Julien
收藏  |  浏览/下载：18/0  |  提交时间：2019/12/02

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