Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin

doi:10.1007/s11664-020-08393-3

	Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin
	Sun, Xuemin 1; Yu, Weiyuan 1; Wang, Yanhong 2
刊名	Journal of Electronic Materials
	2020-11-01
卷号	49 期号:11 页码:6590-6597
关键词	Activation energy Copper Liquids Microelectronics Soldering Thermal gradients Tin Ultrasonics Copper dissolution Development trends Dissolution kinetics Dissolution rates Enhanced dissolutions Microelectronic products Multifunctionality Sound pressure distribution
ISSN号	03615235
DOI	10.1007/s11664-020-08393-3
英文摘要	With the development trend of high speed, light weight, continual miniaturization, and multifunctionality of microelectronic products, the size of solder joints continues to shrink. Therefore, higher requirements are being placed on soldering techniques. This study used the immersion method to investigate the dissolution kinetics of copper in liquid tin at temperatures in the range of 240300C with ultrasonic and current coupling. The amount of dissolution and the thickness of the interfacial intermetallic compound (IMC) layer were measured and the dissolution activation energy was calculated. Results showed that the composite fields of ultrasonic and current coupling accelerated copper dissolution in liquid tin and decreased the dissolution activation energy. The dissolution rate was 57 times higher compared to that without ultrasound and current, and was 23 times higher compared to that using only current. At a certain temperature, with the increase in immersion time, the thickness of the interface IMC layer demonstrated parabolic growth. The sound pressure caused by the ultrasound and the temperature gradient caused by current in the liquid tin were simulated by finite element modeling. The results show that the sound pressure distribution in liquid tin was uneven, and the temperature gradient inside the liquid tin increased with current. © 2020, The Minerals, Metals & Materials Society.
语种	英语
出版者	Springer
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/115001]
专题	实验室建设与管理处土木工程学院
作者单位	1.State Key Laboratory of Gansu Province, Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou; Gansu Province; 730050, China; 2.School of Civil Engineering, Lanzhou University of Technology, Lanzhou; Gansu Province; 730050, China
推荐引用方式 GB/T 7714	Sun, Xuemin,Yu, Weiyuan,Wang, Yanhong. Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin[J]. Journal of Electronic Materials,2020,49(11):6590-6597.
APA	Sun, Xuemin,Yu, Weiyuan,&Wang, Yanhong.(2020).Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin.Journal of Electronic Materials,49(11),6590-6597.
MLA	Sun, Xuemin,et al."Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin".Journal of Electronic Materials 49.11(2020):6590-6597.