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CORC

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Low-Resistance and Strong-Adhesion Soldering of Second-Generation High-Temperature Superconductor Tapes Within a Short Time 期刊论文
IEEE Transactions on Applied Superconductivity, 2017, 卷号: 27
作者:  Zheng, Jiahui[1];  Ma, Hongliang[2];  He, Rong[3];  Lu, Yuming[4];  Song, Haoyu[5]
收藏  |  浏览/下载：10/0  |  提交时间：2019/04/24
Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Ni-P solder joints 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2016, 卷号: 28, 页码: 215-221
作者:  Yan, Xingchen[1];  Xu, Kexin[2];  Wang, Junjie[3];  Wei, Xicheng[4];  Wang, Wurong[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/26
Characterization of nano-enhanced interconnect materials for fine pitch assembly 期刊论文
Soldering and Surface Mount Technology, 2014, 卷号: 26, 页码: 12-17
作者:  Zhang, Yan[1];  Sitek, Janusz[2];  Fan, Jing-Yu[3];  Ma, Shiwei[4];  Koscielski, Marek[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30
Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal ageing 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2014, 卷号: 26, 页码: 173-179
作者:  Ju, Guokui[1];  Lin, Fei[2];  Bi, Wenzhen[3];  Han, Yongjiu[4];  Wang Junjie[5]
收藏  |  浏览/下载：7/0  |  提交时间：2019/04/30
Surface oxide analysis of lead-free solder particles 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2013, 卷号: 25, 页码: 39-44
作者:  Luo, Xin[1];  Du, Wenhui[2];  Lu, Xiuzhen[3];  Yamaguchi, Toshikazu[4];  Jackson, Gavin[5]
收藏  |  浏览/下载：7/0  |  提交时间：2019/04/30
Study on Low Silver Sn-Ag-Cu-P Alloy for Wave Soldering 会议论文
PROCEEDINGS OF THE 2013 20TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2013), 2013-07-15
作者:  Wang, Junjie[1];  Wei, Xicheng[2];  Zhu, Wenqi[3];  Wu, Jian[4];  Wu, Nianzu[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30
Interfacial IMC layer growth and tensile properties of low-silver Cu/SACBE/Cu solder joints 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2012, 卷号: 24, 页码: 249-256
作者:  Bi, Wenzhen[1];  Ju, Guokui[2];  Lin, Fei[3];  Xie, Shifang[4];  Wei, Xicheng[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30
The comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.50Cu (Sn0.4Co0.7Cu)/Cu joints during isothermal aging and their tensile strengths 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2008, 卷号: 20, 页码: 4-10
作者:  Guo-kui, Ju[1];  Xi-cheng, Wei[2];  Peng, Sun[3];  Johan, Liu[4]
收藏  |  浏览/下载：1/0  |  提交时间：2019/05/06
Assessment of lead-free inert gas soldering using a novel reflow technology 会议论文
ESTC 2006 - 1st Electronics Systemintegration Technology Conference, 2006-09-05
作者:  Ayoade, Oyebode[1];  Cristina, Andersson[2];  Tobias, Hjertkvist[3];  Johan, Liu[4]
收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10
Process and pad design optimization for 01005 passive component surface mount assembly 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2007, 卷号: 19, 页码: 34-44
作者:  Wang, Yu[1];  Olorunyomi, Michael[2];  Dahlberg, Martin[3];  Djurovic, Zoran[4];  Anderson, Johan[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/05/10

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