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浏览/检索结果: 共15条，第1-10条 帮助 限定条件 发表日期：2020     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong 收藏  |  浏览/下载：2/0  |  提交时间：2022/02/17 Activation energy  Copper  Liquids  Microelectronics  Soldering  Thermal gradients  Tin  Ultrasonics  Copper dissolution  Development trends  Dissolution kinetics  Dissolution rates  Enhanced dissolutions  Microelectronic products  Multifunctionality  Sound pressure distribution   Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong 收藏  |  浏览/下载：8/0  |  提交时间：2020/11/14 Activation energy  Copper  Liquids  Microelectronics  Soldering  Thermal gradients  Tin  Ultrasonics  Copper dissolution  Development trends  Dissolution kinetics  Dissolution rates  Enhanced dissolutions  Microelectronic products  Multifunctionality  Sound pressure distribution   Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly 期刊论文 ACTA METALLURGICA SINICA, 2020, 卷号: 56, 期号: 10, 页码: 1433-1440 作者:  Jiang Lin;  Zhang Liang;  Liu Zhiquan 收藏  |  浏览/下载：36/0  |  提交时间：2021/02/02 diffusion welding  Al interlayer  Ni(V) transition layer  welding residual stress  Co target  finite element simulation   The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文 MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6 作者:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang;  He, Xin 收藏  |  浏览/下载：69/0  |  提交时间：2021/02/02 Co sputtering target  Soldering assembly  Interface  IMC  Growth mechanism   Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：16/0  |  提交时间：2020/11/14 Bismuth compounds  Diffusion barriers  Gold  Gold compounds  Heat resistance  Microstructure  Nickel  Open circuit voltage  Soldering  Barrier films  Diffusion barrier films  Electrical resistances  Output current  Reflow--soldering  Solder joints  Temperature differences  Thermoelectric   Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan 收藏  |  浏览/下载：46/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism   Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan 收藏  |  浏览/下载：42/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism   Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 14, 页码: 11470-11481 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Zhang, Zhe;  Li, Qinglin 收藏  |  浏览/下载：5/0  |  提交时间：2020/11/14 Binary alloys  Diffusion  Growth rate  Soldering  Atomic diffusions  Compound layer  Diffusion channels  Diffusion process  Micro-structure evolutions  Plating thickness  Solder joint reliability  Solder joints   Development and Test Results of a Full-Size Joint Sample for the CFETR Central Solenoid Model Coil 期刊论文 IEEE TRANSACTIONS ON PLASMA SCIENCE, 2020, 卷号: 48 作者:  Ma, Guanghui;  Wu, Yu;  Qin, Jinggang;  Liu, Huajun;  Hao, Qiangwang 收藏  |  浏览/下载：84/0  |  提交时间：2020/10/26 Conductors  Welding  Cable shielding  Resistance  Steel  Soldering  Silver  Cable-in-conduit conductor (CICC)  central solenoid model coil (CSMC)  Chinese Fusion Engineering Testing Reactor (CFETR)  dc resistance  joint   Fabrication and Test of Diameter 35 mm Iron-Based Superconductor Coils 期刊论文 IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2020, 卷号: 30 作者:  Zhang, Zhan;  Wang, Dongliang;  Liu, Fang;  Jiange, Donghui;  Wei, Shaoqing 收藏  |  浏览/下载：80/0  |  提交时间：2020/11/26 Coils  Heat treatment  Soldering  Critical current density (superconductivity)  Yttrium barium copper oxide  Copper  Critical current  High field  Iron-based superconductor  IBS application