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CORC

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Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2019, 卷号: 32, 期号: 2, 页码: 73-81
作者:  Liu, Yun;  Yu, Weiyuan;  Sun, Xuemin;  Wang, Fengfeng
收藏  |  浏览/下载：0/0  |  提交时间：2020/06/16
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
作者:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
收藏  |  浏览/下载：21/0  |  提交时间：2021/02/02
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
作者:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
收藏  |  浏览/下载：10/0  |  提交时间：2021/02/02
Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602
作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun
收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17
Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602
作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun
收藏  |  浏览/下载：2/0  |  提交时间：2019/11/15
Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C 期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668
作者:  Sui, Ran;  Li, Fuxiang;  Ci, Wenjuan;  Lin, Qiaoli
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
Wetting of amorphous and partial crystalline Co73Si10B17 by Sn and Sn-based lead-free solders 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 98, 页码: 112-118
作者:  Lin, Qiaoli;  Ye, Changsheng;  Sui, Ran;  Ci, Wenjuan
收藏  |  浏览/下载：12/0  |  提交时间：2019/11/15
Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350 degrees C 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668
作者:  Sui, Ran;  Li, Fuxiang;  Ci, Wenjuan;  Lin, Qiaoli
收藏  |  浏览/下载：6/0  |  提交时间：2019/11/15
Soldering system and soldering method 专利
专利号: WO2019065065A1, 申请日期: 2019-04-04, 公开日期: 2019-04-04
作者:  FUJISHIMA TOSHITERU;  TADAMA SHIGERU;  KOBAYASHI HIRONOBU
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/31

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