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科研机构
金属研究所 [31]
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期刊论文 [31]
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2022 [1]
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Interfacial reactions at Ga-21.5In-10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions
期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2022, 卷号: 282, 页码: 16
作者:
Gao, Zhaoqing
;
Wang, Chen
;
Chai, Zhenbang
;
Chen, Yinbo
;
Shen, Chenyu
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2022/07/14
Intermetallics
Microstructure
Temperature gradient
Preferred orientation
Ga-21-5In-10Sn alloys
Interfaces
Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly
期刊论文
ACTA METALLURGICA SINICA, 2020, 卷号: 56, 期号: 10, 页码: 1433-1440
作者:
Jiang Lin
;
Zhang Liang
;
Liu Zhiquan
收藏
  |  
浏览/下载:36/0
  |  
提交时间:2021/02/02
diffusion welding
Al interlayer
Ni(V) transition layer
welding residual stress
Co target
finite element simulation
The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering
期刊论文
MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6
作者:
Liu, Zhi-Quan
;
Meng, Zhi-Chao
;
Wu, Di
;
Shang, Zhengang
;
He, Xin
收藏
  |  
浏览/下载:69/0
  |  
提交时间:2021/02/02
Co sputtering target
Soldering assembly
Interface
IMC
Growth mechanism
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:
Gao, Li-Yin
;
Cui, Xian-Wei
;
Tian, Fei-Fei
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:46/0
  |  
提交时间:2021/02/02
Mixed soldering
ball grid array
solidification
crack
shrinkage
failure mechanism
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:
Gao, Li-Yin
;
Cui, Xian-Wei
;
Tian, Fei-Fei
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:42/0
  |  
提交时间:2021/02/02
Mixed soldering
ball grid array
solidification
crack
shrinkage
failure mechanism
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method
期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
作者:
Jiang, Lin
;
Zhang, Liang
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2021/02/02
Co target assembly
Solder
Residual stress
Simulation
Taguchi method
Optimal design
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method
期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
作者:
Jiang, Lin
;
Zhang, Liang
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2021/02/02
Co target assembly
Solder
Residual stress
Simulation
Taguchi method
Optimal design
A new quantizing insulator soldering technology scheme for microwave module
期刊论文
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2019, 卷号: 61, 期号: 4, 页码: 979-984
作者:
Tian, Fei-Fei
;
Zhou, Ming
;
Zhang, Jun Zhi
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2021/02/02
microwave module
quatization
soldering
solid solder ring
A new quantizing insulator soldering technology scheme for microwave module
期刊论文
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2019, 卷号: 61, 期号: 4, 页码: 979-984
作者:
Tian, Fei-Fei
;
Zhou, Ming
;
Zhang, Jun Zhi
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2021/02/02
microwave module
quatization
soldering
solid solder ring
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:
Shi, QY
;
Liu, ZQ
;
Wu, D
;
Zhang, H
;
Ni, DR
收藏
  |  
浏览/下载:30/0
  |  
提交时间:2018/06/05
Al/diamond Composites
Thermal-conductivity
Coated Diamond
Heat Sinks
Densification
Microstructure
Mechanisms
Strength
Surface
Growth
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