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金属研究所 [30]

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浏览/检索结果: 共83条，第1-10条

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	Improving thermal conductivity of polyvinylidene fluoride/low-melting-point alloy with segregated structure induced by incorporation of silver interface layer 期刊论文 JOURNAL OF POLYMER RESEARCH, 2022, 卷号: 29 作者: Zhang, Ping; Zhang, Xian; Ding, Xin; Wang, Yanyan; Xiao, Chao 收藏 \| 浏览/下载：18/0 \| 提交时间：2022/12/23 Segregated structure Intermetallic compound Thermal conductivity Sliver interface layer
	Research on Bi contents addition into Sn-Cu-based lead-free solder alloy 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603 作者: Huang, Hai; Chen, Bin; Hu, Xiaowu; Jiang, Xiongxin; Li, Qinglin 收藏 \| 浏览/下载：87/0 \| 提交时间：2022/07/19 Binary alloysCopper corrosionCorrosion protectionCorrosion resistanceCorrosion resistant alloysCorrosive effectsDifferential scanning calorimetryElectrochemical corrosionElectrochemical impedance spectroscopyLead alloysLead-free soldersPassivationScanning electron microscopySemiconductor dopingTensile strengthThermodynamic propertiesTin alloysVickers hardness Cu-basedElectrochemicalsLead-free solder alloyMechanical performanceMechanical resistanceSolder alloysUndercoolingsUniversal testing machinesVicker hardnessX- ray diffractions
	Enhanced mechanical properties and corrosion behavior of Zn-30Sn-2Cu high-temperature lead-free solder alloy by adding Sm 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 9, 页码: 6469-6484 作者: Zhang, Huajin; Hu, Xiaowu; Liu, Yi; Zhang, Jiankang; Jiang, Xiongxin 收藏 \| 浏览/下载：27/0 \| 提交时间：2022/03/01 Corrosion resistance Corrosion resistant alloys Corrosive effects Ductile fracture Electrochemical impedance spectroscopy Galvanic corrosion High temperature corrosion Lead-free solders Morphology Tensile strength Zinc Zinc alloys Corrosion behaviour Electrochemical-impedance spectroscopies Fracture morphology Highest temperature Lead-free solder alloy Polarization impedance Potentiodynamics polarization Rich phase Sm addition Ultimate tensile strength
	Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15 作者: Chen, Yinbo; Meng, Zhi-Chao; Gao, Li-Yin; Liu, Zhi-Quan 收藏 \| 浏览/下载：12/0 \| 提交时间：2021/03/15
	Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262 作者: Liu, C. Z.; Wang, J. J.; Zhu, M. W.; Liu, X. M.; Lu, T. N. 收藏 \| 浏览/下载：25/0 \| 提交时间：2021/02/03
	Reactive infiltration and microstructural characteristics of Sn-V active solder alloys on porous graphite 期刊论文 Materials, 2020, 卷号: 13, 期号: 7 作者: Zhang, Yubin; Liao, Xinjiang; Lin, Qiaoli; Mu, Dekui; Lu, Jing 收藏 \| 浏览/下载：5/0 \| 提交时间：2020/11/14 Binary alloys Carbides Graphite Growth kinetics Infiltration Lead-free solders Magnetic bubbles Mass transfer Reaction kinetics Tin compounds Vanadium compounds Wetting Apparent contact angle Micro-structural characteristics Micro-structural characterization Porous graphite Quasi-equilibrium state Reactive infiltration Reactive wetting Three-phase contact line
	Reactive wetting of Sn-V solder alloys on polycrystalline CVD diamond 期刊论文 Applied Surface Science, 2020, 卷号: 504 作者: Liao, Xinjiang; He, Qiqi; Lin, Qiaoli; Mu, Dekui; Huang, Hui 收藏 \| 浏览/下载：3/0 \| 提交时间：2020/11/14 Adsorption Binary alloys Chemical bonds Chemical vapor deposition Lead-free solders Reaction kinetics Synthetic diamonds Tin compounds Wetting Bonding techniques Chemical vapour deposition CVD Diamond Interface reactions Polycrystalline CVD diamond Precursor films Sessile drop method Spreading kinetics
	Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文 SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444 作者: Zhao, Meng; Zhang, Liang; Liu, Zhi-Quan; Xiong, Ming-Yue; Sun, Lei 收藏 \| 浏览/下载：129/0 \| 提交时间：2021/02/02 Sn-Cu microstructures IMC mechanical properties
	Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system 期刊论文 VACUUM, 2019, 卷号: 167, 页码: 77-89 作者: Hu, Xiaowu; Li, Chao; Li, Qinglin; Yi, Guangbin 收藏 \| 浏览/下载：5/0 \| 提交时间：2019/11/15 SAC305 lead-free solders Interfacial reaction Intermetallic compound Shear strength Fracture
	Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063 作者: Zhao, Meng; Zhang, Liang; Liu, Zhi-quan; Xiong, Ming-yue; Sun, Lei 收藏 \| 浏览/下载：19/0 \| 提交时间：2021/02/02

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