| Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate | |
| Liu, Xiaoying; Huang, Mingliang; Zhao, Ning; Wang, Lai | |
| 刊名 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| 2014 | |
| 卷号 | 25页码:328-337 |
| ISSN号 | 0957-4522 |
| URL标识 | 查看原文 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4425391 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Liu, Xiaoying,Huang, Mingliang,Zhao, Ning,et al. Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2014,25:328-337. |
| APA | Liu, Xiaoying,Huang, Mingliang,Zhao, Ning,&Wang, Lai.(2014).Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,25,328-337. |
| MLA | Liu, Xiaoying,et al."Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 25(2014):328-337. |
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