CORC

在结果中检索

CORC

浏览/检索结果: 共69条，第1-10条 帮助

已选(0)清除 条数/页：   排序方式：
Study on Signal Enhancement Technology for Atomic Fluorescence Spectrometry Based on Digital Micromirror Device 期刊论文
Chinese Journal of Analytical Chemistry, 2021, 卷号: 49, 期号: 9
作者:  H. X. Wang;  Y. C. Li;  C. S. Li;  Z. H. Zhou;  Z. Y. Ma and D. Tian
收藏  |  浏览/下载：5/0  |  提交时间：2022/06/13
Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint 期刊论文
Journal of Alloys and Compounds, 2020, 卷号: 832
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：20/0  |  提交时间：2020/11/14
Production mechanism of proton-rich actinide isotopes in fusion reactions and via multinucleon transfer processes 期刊论文
PHYSICAL REVIEW C, 2020, 卷号: 102, 期号: 1, 页码: 13
作者:  Chen, Peng-Hui;  Niu, Fei;  Feng, Zhao-Qing
收藏  |  浏览/下载：12/0  |  提交时间：2022/01/12
Geochemistry of sulfide minerals from skarn Cu (Au) deposits in the Fenghuangshan ore field, Tongling, eastern China: Insights into ore-forming process 期刊论文
ORE GEOLOGY REVIEWS, 2020, 卷号: 122, 页码: 18
作者:  Xie, Jiancheng;  Tang, Dawei;  Qian, Lin;  Wang, Yu;  Sun, Weidong
收藏  |  浏览/下载：26/0  |  提交时间：2020/09/25
Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 14, 页码: 11470-11481
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Zhang, Zhe;  Li, Qinglin
收藏  |  浏览/下载：5/0  |  提交时间：2020/11/14
Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 788
作者:  Bi, Xiaoyang;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：15/0  |  提交时间：2022/03/01
Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint 期刊论文
Applied Physics A: Materials Science and Processing, 2020, 卷号: 126, 期号: 4
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin;  Jiang, Xiongxin
收藏  |  浏览/下载：4/0  |  提交时间：2020/11/14
Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C 期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668
作者:  Sui, Ran;  Li, Fuxiang;  Ci, Wenjuan;  Lin, Qiaoli
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
Synergistic Effect of Bismuth and Indium Codoping for High Thermoelectric Performance of Melt Spinning SnTe Alloys 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2019, 卷号: 11, 期号: 26, 页码: 23337-23345
作者:  Tang, Huan;  Guo, Lijie;  Wang, Guiwen;  Wu, Hong;  Shen, Xingchen
收藏  |  浏览/下载：60/0  |  提交时间：2019/12/03
Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350 degrees C 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668
作者:  Sui, Ran;  Li, Fuxiang;  Ci, Wenjuan;  Lin, Qiaoli
收藏  |  浏览/下载：6/0  |  提交时间：2019/11/15

©版权所有 ©2017 CSpace - Powered by CSpace