Wetting behavior in ultrasonic vibration-assisted brazing of aluminum to graphite using Sn-Ag-Ti active solder

doi:10.1142/S0218625X15500353

	Wetting behavior in ultrasonic vibration-assisted brazing of aluminum to graphite using Sn-Ag-Ti active solder
	Yu, Wei-Yuan; Liu, Sen-Hui; Liu, Xin-Ya; Shao, Jia-Lin; Liu, Min-Pen
刊名	Surface Review and Letters
	2015-06-14
卷号	22 期号:3
关键词	Aluminum Atmospheric temperature Brazing Graphite Lead-free solders Liquids Oxides Silver alloys Silver oxides Ternary alloys Tin alloys Titanium alloys Titanium dioxide Ultrasonic effects Ultrasonic waves Active brazing Ambient conditions Atmospheric conditions Brazing temperature Decomposition temperature Pure aluminum Ultrasonic vibration Wetting and spreading
ISSN号	0218625X
DOI	10.1142/S0218625X15500353
英文摘要	In this study, Sn-Ag-Ti ternary alloy has been used as the active solder to braze pure aluminum and graphite in atmospheric conditions using ultrasonic vibration as an aid. The authors studied the formation, composition and decomposition temperature of the surface oxides of the active solder under atmospheric conditions. In addition, the wettability of Sn-5Ag-8Ti active solder on the surface of pure aluminum and graphite has also been studied. The results showed that the major components presented in the surface oxides formed on the Sn-5Ag-8Ti active solder under ambient conditions are TiO, TiO2, Ti2O3, Ti3O5 and SnO2. Apart from AgO and Ag2O2, which can be decomposed at the brazing temperature (773 K), other oxides will not be decomposed. The oxide layer comprises composite oxides and it forms a compact layer with a certain thickness to enclose the melted solder, which will prevent the liquid solder from wetting the base metals at the brazing temperature. After ultrasonic vibration, the oxide layer was destroyed and the liquid solder was able to wet and spread out around the base materials. Furthermore, better wettability of the active solder was observed on the surface of graphite and pure aluminum at the brazing temperature of 773-823 K using ultrasonic waves. The ultrasonic wave acts as the dominant driving factor which promotes the wetting and spreading of the liquid solder on the surface of graphite and aluminum to achieve a stable and reliable brazed joint. © 2015 World Scientific Publishing Company.
WOS研究方向	Chemistry ; Physics
语种	英语
出版者	World Scientific Publishing Co. Pte Ltd
WOS记录号	WOS:000354413700003
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/112320]
专题	实验室建设与管理处
作者单位	Department of Materials Science and Engineering, Lanzhou University of Technology, State Key Laboratory of Advanced Processing and Recycling of Non-Ferrous Metals in Gansu Province, Lanzhou City, Gansu Province; 730050, China
推荐引用方式 GB/T 7714	Yu, Wei-Yuan,Liu, Sen-Hui,Liu, Xin-Ya,et al. Wetting behavior in ultrasonic vibration-assisted brazing of aluminum to graphite using Sn-Ag-Ti active solder[J]. Surface Review and Letters,2015,22(3).
APA	Yu, Wei-Yuan,Liu, Sen-Hui,Liu, Xin-Ya,Shao, Jia-Lin,&Liu, Min-Pen.(2015).Wetting behavior in ultrasonic vibration-assisted brazing of aluminum to graphite using Sn-Ag-Ti active solder.Surface Review and Letters,22(3).
MLA	Yu, Wei-Yuan,et al."Wetting behavior in ultrasonic vibration-assisted brazing of aluminum to graphite using Sn-Ag-Ti active solder".Surface Review and Letters 22.3(2015).