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	Research on Bi contents addition into Sn-Cu-based lead-free solder alloy 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603 作者: Huang, Hai 收藏 \| 浏览/下载：88/0 \| 提交时间：2022/07/19 Binary alloysCopper corrosionCorrosion protectionCorrosion resistanceCorrosion resistant alloysCorrosive effectsDifferential scanning calorimetryElectrochemical corrosionElectrochemical impedance spectroscopyLead alloysLead-free soldersPassivationScanning electron microscopySemiconductor dopingTensile strengthThermodynamic propertiesTin alloysVickers hardness Cu-basedElectrochemicalsLead-free solder alloyMechanical performanceMechanical resistanceSolder alloysUndercoolingsUniversal testing machinesVicker hardnessX- ray diffractions
	Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11 作者: Chen, Yinbo; Wang, Changchang; Gao, Yue; Gao, Zhaoqing; Liu, Zhi-Quan 收藏 \| 浏览/下载：16/0 \| 提交时间：2022/01/27
	Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints 期刊论文 MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8 作者: Gao, Li-Yin; Luo, Yi-Xiu; Wan, Peng; Liu, Zhi-Quan 收藏 \| 浏览/下载：228/0 \| 提交时间：2021/10/15 Solder joint Intermetallic compound Mechanical property Nano-indentation First principle calculation
	Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint 期刊论文 Journal of Alloys and Compounds, 2020, 卷号: 832 作者: Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：20/0 \| 提交时间：2020/11/14 Bismuth compounds Diffusion Electric resistance Electrodes Growth rate IV-VI semiconductors Microstructure Scanning electron microscopy Tin Tin compounds Transmission electron microscopy Diffusion process Electrical resistances Micro-structure evolutions Porous structures Thermodynamically stable Thermoelectric Volume diffusion X ray diffractometers
	Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders 期刊论文 Microelectronics Reliability, 2020, 卷号: 111 作者: Lin, Qiaoli; Ye, Changsheng; Sui, Ran 收藏 \| 浏览/下载：3/0 \| 提交时间：2020/11/14 Amorphous alloys Binary alloys Copper alloys Lead alloys Nickel oxide Oxide films Silver alloys Ternary alloys Tin Crystalline alloys Interfacial reactivity Minimum surfaces Primary crystallization Sn-based solders Volume shrinkage Wetting balance methods Wetting mechanism
	Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations 期刊论文 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 788 作者: Bi, Xiaoyang; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：15/0 \| 提交时间：2022/03/01 Solder joints Ni-Co film Shear strength Atomic model Intermetallic compound First-principles calculations
	Wettability of amorphous and crystalline Co73Si10B17 by lead-free solders 期刊论文 Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2020, 卷号: 30, 期号: 6, 页码: 1329-1337 作者: Ye, Chang-Sheng; Ci, Wen-Juan; Lin, Qiao-Li; Sui, Ran; Wang, Jian-Bin 收藏 \| 浏览/下载：3/0 \| 提交时间：2020/11/14 Binary alloys Cobalt alloys Copper alloys Descaling Free energy Lead-free solders Oxide films Silicon Silicon compounds Silver alloys Surface reactions Ternary alloys Tin Wetting Co-based alloys Crystalline state Sn-based solders Surface free energy Surface oxide films Temperature range Wetting balance methods Wetting mechanism
	Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 3, 页码: 2320-2330 作者: Zhang, Xudong; Hu, Xiaowu; Jiang, Xiongxin; Zhou, Liuru; Li, Qinglin 收藏 \| 浏览/下载：11/0 \| 提交时间：2020/06/16 Additives Atomic force microscopy Binary alloys Chlorine compounds Copper Copper compounds Electron probe microanalysis Electrons High resolution transmission electron microscopy Metallic films Scanning electron microscopy Tin alloys Tin metallography X ray photoelectron spectroscopy Crystallographic orientations Electron back scatter diffraction Electroplated copper film Electroplated Cu films Impurity incorporation Micro-structural characterization Microstructural instability Plating solutions
	Investigations on elastic properties and electronic structures of alpha-CoSn3 doped with Ni via first-principles calculations and nano-indentation measurements 期刊论文 RESULTS IN PHYSICS, 2019, 卷号: 15 作者: Bi, Xiaoyang; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：8/0 \| 提交时间：2022/03/01 Intermetallic compound Nano-indentation First-principles calculations Mechanical properties
	Effects of aluminum addition (x=0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文 MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 8 作者: Li, Jiayin; Hu, Xiaowu; Zhang, Xudong; Li, Qinglin 收藏 \| 浏览/下载：10/0 \| 提交时间：2019/11/15 Zn-Sn alloys mechanical properties fracture analysis microstructure refinement

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