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浏览/检索结果: 共3条，第1-3条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Liquid-state Interfacial Reactions between Sn-Ag-Cu-Fe Composite Solders and Cu Substrate 会议论文 International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, PEOPLES R CHINA, 2009-08-10 作者:  Liu, Xiaoying;  Zhao, Yanhui;  Huang, Mingliang;  Wu, C. M. L.;  Wang, Lai 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/24 The evaluation of the new composite lead free solders with the novel fabricating process 会议论文 International Conference on the Business of Electronic Product Reliability and Liability, Shanghai, PEOPLES R CHINA, 2004-04-27 作者:  Wang, L;  Yu, DQ;  Han, SQ;  Ma, HT;  Xie, HP 收藏  |  浏览/下载：3/0  |  提交时间：2020/01/02 lead free solder  Sn-Ag-Cu  Y2O3  composite  microstructure  shear strength  wetting   Creep fracture behaviour of joints soldered by a nano-composite solder, lead-free and conventional tin-lead solders (EI收录) 会议论文 11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005 作者:  Zhang, X.P.[1,2];  Shi, Y.W.[3];  Mai, Y.W.[1];  Shrestha, S.[4];  Dorn, L.[4] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/18 Creep  Creep resistance  Fractography  Fracture  Fracture mechanics  Lead  Microelectronics  Nanocomposites  Particle reinforced composites  Silver  Silver alloys  Soldering alloys  Textures