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Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 卷号: 25, 页码: 328-337
作者:  Liu, Xiaoying;  Huang, Mingliang;  Zhao, Ning;  Wang, Lai
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