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浏览/检索结果: 共3条，第1-3条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 14, 页码: 11470-11481 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Zhang, Zhe;  Li, Qinglin 收藏  |  浏览/下载：5/0  |  提交时间：2020/11/14 Binary alloys  Diffusion  Growth rate  Soldering  Atomic diffusions  Compound layer  Diffusion channels  Diffusion process  Micro-structure evolutions  Plating thickness  Solder joint reliability  Solder joints   Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint 期刊论文 Applied Physics A: Materials Science and Processing, 2020, 卷号: 126, 期号: 4 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin;  Jiang, Xiongxin 收藏  |  浏览/下载：4/0  |  提交时间：2020/11/14 Ductile fracture  Microstructure  Soldering  Fracture mechanisms  IMC layer  Liquid-state reaction  Micro-structure evolutions  Ni additions  Reflow--soldering  Solder joints  Synergistic effect   Effects of Ag on the microstructure and shear strength of rapidly solidified Sn–58Bi solder 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 7 作者:  Liu, Shengfa;  Song, Tianjie;  Xiong, Wenyong;  Liu, Li;  Liu, Zhangyang 收藏  |  浏览/下载：9/0  |  提交时间：2019/12/05