Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder

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	Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder
	Yang, Fan ; Zhang, Liang ; Liu, Zhi-quan ; Zhong, Su Juan ; Ma, Jia ; Bao, Li
刊名	MATERIALS
	2017-05-01
卷号	10 期号:5 页码:-
关键词	Sn-58Bi solder lead-free solder microstructure
ISSN号	1996-1944
通讯作者	Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou 221116, Peoples R China. ; Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
中文摘要	With the purpose of improving the properties of the Sn-58Bi lead-free solder, micro-CuZnAl particles ranging from 0 to 0.4 wt % were added into the low temperature eutectic Sn-58Bi lead-free solder. After the experimental testing of micro-CuZnAl particles on the properties and microstructure of the Sn-58Bi solders, it was found that the wettability of the Sn-58Bi solders was obviously improved with addition of CuZnAl particles. When the addition of CuZnAl particles was 0.2 wt %, the wettability of the Sn-58Bi solder performed best. At the same time, excessive addition of CuZnAl particles led to poor wettability. However, the results showed that CuZnAl particles changed the melting point of the Sn-58Bi solder slightly. The microstructure of the Sn-58Bi solder was refined by adding CuZnAl particles. When the content of CuZnAl addition was between 0.1 and 0.2 wt %, the refinement was great. In addition, the interfacial IMC layer between new composite solder and Cu substrate was thinner than that between the Sn-58Bi solder and Cu substrate.
学科主题	Materials Science, Multidisciplinary
收录类别	SCI
资助信息	Research Innovation Project for College Graduate of Jiangsu Province [KYZZ16_0469]; Natural Science Foundation of China [51475220]; State Foundation of Laboratory of Advanced Brazing Filler Metals & Technology (Zhengzhou Research Institute of Mechanical Engineering) [SKLABFMT-2015-03]; High Level Talent Plan of Jiangsu Normal University [YQ2015002]
语种	英语
公开日期	2017-08-17
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/78148]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	Yang, Fan,Zhang, Liang,Liu, Zhi-quan,et al. Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder[J]. MATERIALS,2017,10(5):-.
APA	Yang, Fan,Zhang, Liang,Liu, Zhi-quan,Zhong, Su Juan,Ma, Jia,&Bao, Li.(2017).Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder.MATERIALS,10(5),-.
MLA	Yang, Fan,et al."Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder".MATERIALS 10.5(2017):-.