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	Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文 Microelectronics Reliability, 2022, 卷号: 135 作者: Yu, Weiyuan; Li, Binbin; Wu, Baolei; Wang, Fengfeng; Wang, Mingkang 收藏 \| 浏览/下载：18/0 \| 提交时间：2022/08/09 Binary alloys Copper Copper alloys Indium alloys Lead-free solders Microstructure Shear flow Silicon carbide Soldering Temperature Thermoelectric equipment Wide band gap semiconductors Composite solders Electronics devices In-45cu composite solder paste Intermetallics compounds Microstructures and mechanical properties Service temperature Shears strength Solderpaste Ultrasonic action time Ultrasonic-assisted TLP
	Enhanced mechanical properties and corrosion behavior of Zn-30Sn-2Cu high-temperature lead-free solder alloy by adding Sm 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 9, 页码: 6469-6484 作者: Zhang, Huajin; Hu, Xiaowu; Liu, Yi; Zhang, Jiankang; Jiang, Xiongxin 收藏 \| 浏览/下载：27/0 \| 提交时间：2022/03/01 Corrosion resistance Corrosion resistant alloys Corrosive effects Ductile fracture Electrochemical impedance spectroscopy Galvanic corrosion High temperature corrosion Lead-free solders Morphology Tensile strength Zinc Zinc alloys Corrosion behaviour Electrochemical-impedance spectroscopies Fracture morphology Highest temperature Lead-free solder alloy Polarization impedance Potentiodynamics polarization Rich phase Sm addition Ultimate tensile strength
	Wettability of amorphous and crystalline Co73Si10B17 by lead-free solders 期刊论文 Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2020, 卷号: 30, 期号: 6, 页码: 1329-1337 作者: Ye, Chang-Sheng; Ci, Wen-Juan; Lin, Qiao-Li; Sui, Ran; Wang, Jian-Bin 收藏 \| 浏览/下载：3/0 \| 提交时间：2020/11/14 Binary alloys Cobalt alloys Copper alloys Descaling Free energy Lead-free solders Oxide films Silicon Silicon compounds Silver alloys Surface reactions Ternary alloys Tin Wetting Co-based alloys Crystalline state Sn-based solders Surface free energy Surface oxide films Temperature range Wetting balance methods Wetting mechanism
	Reactive infiltration and microstructural characteristics of Sn-V active solder alloys on porous graphite 期刊论文 Materials, 2020, 卷号: 13, 期号: 7 作者: Zhang, Yubin; Liao, Xinjiang; Lin, Qiaoli; Mu, Dekui; Lu, Jing 收藏 \| 浏览/下载：5/0 \| 提交时间：2020/11/14 Binary alloys Carbides Graphite Growth kinetics Infiltration Lead-free solders Magnetic bubbles Mass transfer Reaction kinetics Tin compounds Vanadium compounds Wetting Apparent contact angle Micro-structural characteristics Micro-structural characterization Porous graphite Quasi-equilibrium state Reactive infiltration Reactive wetting Three-phase contact line
	Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文 Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81 作者: Liu, Yun; Yu, Weiyuan; Sun, Xuemin; Wang, Fengfeng 收藏 \| 浏览/下载：8/0 \| 提交时间：2022/02/17 Binary alloys Dissolution Electronics packaging Energy dispersive spectroscopy Intermetallics Lead-free solders Morphology Needles Scanning electron microscopy Shear flow Soldered joints Soldering Tin Tin alloys Tin metallography Ultrasonic effects Ultrasonic waves Uranium metallography Vanadium metallography Design/methodology/approach Dispersion strengthening Energy dispersive X ray spectroscopy Fractured surfaces Grain morphologies Grooves Ultrasonic cavitation Ultrasonic vibration
	Reactive wetting of Sn-V solder alloys on polycrystalline CVD diamond 期刊论文 Applied Surface Science, 2020, 卷号: 504 作者: Liao, Xinjiang; He, Qiqi; Lin, Qiaoli; Mu, Dekui; Huang, Hui 收藏 \| 浏览/下载：3/0 \| 提交时间：2020/11/14 Adsorption Binary alloys Chemical bonds Chemical vapor deposition Lead-free solders Reaction kinetics Synthetic diamonds Tin compounds Wetting Bonding techniques Chemical vapour deposition CVD Diamond Interface reactions Polycrystalline CVD diamond Precursor films Sessile drop method Spreading kinetics
	Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390 作者: Zhang, Qingke; Hu, Fangqin; Song, Zhenlun 收藏 \| 浏览/下载：114/0 \| 提交时间：2020/12/16 LEAD-FREE SOLDERS INTERMETALLIC COMPOUNDS LIQUID SN KINETICS GROWTH CU6SN5 METALLIZATION
	Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者: Yi, Xiong; Yi, Guangbin; Hu, Xiaowu; Li, Qinglin; Zhang, Ruhua 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/14 Atomic force microscopy Coatings Copper compounds Electroplating Gold Growth rate Lead-free solders Metallic films Scanning electron microscopy Semiconductor doping Silver alloys Silver metallography Soldering Substrates Surface roughness Ternary alloys Thermal aging Tin alloys Tin compounds Tin metallography X ray photoelectron spectroscopy Benzotriazole(BTA) Electroplated Cu films Heterocyclic compound Interfacial microstructure evolution Isothermal aging Kovar substrates Low concentrations Soldering process
	Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者: Yu, Weiyuan; Liu, Yingzong; Liu, Yun 收藏 \| 浏览/下载：5/0 \| 提交时间：2022/02/17 Binary alloys Copper compounds Interface states Intermetallics Lead-free solders Microstructure Phase interfaces Soldering Tin compounds Ultrasonic effects Unmanned aerial vehicles (UAV) Formation and evolutions Growth patterns IMC layer Interfacial intermetallics Liquid interface Nonequilibrium state Ultrasonic vibration
	Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system 期刊论文 VACUUM, 2019, 卷号: 167, 页码: 77-89 作者: Hu, Xiaowu; Li, Chao; Li, Qinglin; Yi, Guangbin 收藏 \| 浏览/下载：5/0 \| 提交时间：2019/11/15 SAC305 lead-free solders Interfacial reaction Intermetallic compound Shear strength Fracture

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