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	The role of ERNi-1 wire on microstructure and properties of pure nickel N6 plasma arc welding joint 期刊论文 Materials Research, 2021, 卷号: 24, 期号: 1 作者: Chai, Ting Xing; Zhang, Liang Liang; Wang, Xi Jing; Xu, Hong Tong 收藏 \| 浏览/下载：7/0 \| 提交时间：2021/04/12 Alumina Aluminum Aluminum oxide Austenite Carbon monoxide Corrosion rate Crystallization Electric welding Filler metals Fillers Grain boundaries Grain size and shape Nickel Nitrogen fixation Nucleation Oxide minerals Soldered joints Tensile strength Textures Titanium Titanium dioxide Titanium nitride Welds Wire Austenite grain boundaries Heterogeneous nucleation Microstructure and properties Nitrogen porosities Plasma arc welding (PAW) Single phase austenite Structure and performance Welding thermal cycles
	Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs 期刊论文 Vacuum, 2020, 卷号: 180 作者: Qiu, Hongyu; Hu, Xiaowu; Li, Shuang; Wan, Yongqiang; Li, Qinglin 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/11/14 Binary alloys Copper alloys Elastic moduli Fracture Fracture mechanics Shear flow Soldered joints Surface analysis Tin alloys Area ratios Fracture mechanisms Fracture surface analysis Fracture surfaces Fractured surfaces Isothermal aging Lead-free solder joint Solder joints
	Effect of Compression on Microstructure and Properties of Single Crystal Copper Cold Pressure Welding Joints 期刊论文 Cailiao Daobao/Materials Reports, 2020, 卷号: 34, 期号: 12, 页码: 12110-12114 作者: Huang, Yong; Ran, Xiaolong; Yan, Xiaojuan 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/11/14 Copper Crystal orientation Deformation Microstructure Pressure welding Soldered joints Tensile strength Cold pressure welding Deformation region Electrical conductivity High purity copper Joint microstructures Microstructure and properties Recrystallized grains Single crystal copper
	Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文 Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81 作者: Liu, Yun; Yu, Weiyuan; Sun, Xuemin; Wang, Fengfeng 收藏 \| 浏览/下载：8/0 \| 提交时间：2022/02/17 Binary alloys Dissolution Electronics packaging Energy dispersive spectroscopy Intermetallics Lead-free solders Morphology Needles Scanning electron microscopy Shear flow Soldered joints Soldering Tin Tin alloys Tin metallography Ultrasonic effects Ultrasonic waves Uranium metallography Vanadium metallography Design/methodology/approach Dispersion strengthening Energy dispersive X ray spectroscopy Fractured surfaces Grain morphologies Grooves Ultrasonic cavitation Ultrasonic vibration
	Reliable life prediction of rubber concrete based on temperature cycle degradation model 期刊论文 Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)/Journal of Huazhong University of Science and Technology (Natural Science Edition), 2020, 卷号: 48, 期号: 2, 页码: 42-46 作者: Chen, Kefan; Qiao, Hongxia; Wang, Penghui; Peng, Kuan 收藏 \| 浏览/下载：9/0 \| 提交时间：2020/11/14 Deterioration Elastic moduli Reliability Soldered joints Testing Accelerated life tests Acceleration factors Best linear unbiased estimation Reliability functions Rubber concrete
	Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文 ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614 作者: Cao Lihua; Chen Yinbo; Shi Qiyuan; Yuan Jie; Liu Zhiquan 收藏 \| 浏览/下载：129/0 \| 提交时间：2021/02/02 alloy element Sn-Ag-Cu solder intermetallic compound interfacial morphology shear strength
	Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者: Yi, Xiong; Yi, Guangbin; Hu, Xiaowu; Li, Qinglin; Zhang, Ruhua 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/14 Atomic force microscopy Coatings Copper compounds Electroplating Gold Growth rate Lead-free solders Metallic films Scanning electron microscopy Semiconductor doping Silver alloys Silver metallography Soldering Substrates Surface roughness Ternary alloys Thermal aging Tin alloys Tin compounds Tin metallography X ray photoelectron spectroscopy Benzotriazole(BTA) Electroplated Cu films Heterocyclic compound Interfacial microstructure evolution Isothermal aging Kovar substrates Low concentrations Soldering process
	Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者: Yu, Weiyuan; Liu, Yingzong; Liu, Yun 收藏 \| 浏览/下载：5/0 \| 提交时间：2022/02/17 Binary alloys Copper compounds Interface states Intermetallics Lead-free solders Microstructure Phase interfaces Soldering Tin compounds Ultrasonic effects Unmanned aerial vehicles (UAV) Formation and evolutions Growth patterns IMC layer Interfacial intermetallics Liquid interface Nonequilibrium state Ultrasonic vibration
	Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者: Yu, Weiyuan; Liu, Yingzong; Liu, Yun 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/11/15 Ultrasonic-assisted soldering interfacial intermetallic compounds microstructure tin solder
	Effect of flux doped with Cu6Sn5 nanoparticles on the interfacial reaction of lead-free solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 12, 页码: 11552-11562 作者: Wang, Haozhong; Hu, Xiaowu; Li, Qinglin; Qu, Min 收藏 \| 浏览/下载：5/0 \| 提交时间：2019/11/15 Binary alloys Coarsening Copper Growth rate Morphology Nanoparticles Rate constants Soldered joints Tin alloys Aging time Cu substrate IMC layer Inhibition effect Isothermal aging Lead-free solder joint Nanoparticle (NPs) Solder joints

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