Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces

doi:10.1007/s11664-020-08030-z

CORC > 宁波材料技术与工程研究所 > 中国科学院宁波材料技术与工程研究所 > 2020专题

	Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces
	Zhang, Qingke; Hu, Fangqin; Song, Zhenlun
刊名	JOURNAL OF ELECTRONIC MATERIALS
	2020
卷号	49 期号:5 页码:3383-3390
关键词	LEAD-FREE SOLDERS INTERMETALLIC COMPOUNDS LIQUID SN KINETICS GROWTH CU6SN5 METALLIZATION
DOI	10.1007/s11664-020-08030-z
英文摘要	Soldering can be used in the connection of thin film solar cells, while the soldering quality is difficult to control as the conducting layer on the solar cells is nano-sized and can be consumed within a few seconds. In this study, the microstructure and fracture behavior of the Sn-0.7wt.%Cu/Cu-30wt.%Ni joint interfaces were investigated. The use of CuNi conducting layer deposited on the Al/Si film with about 150 nm thickness and a soldering time of a few seconds were investigated. The results reveal that dense rod-like (Cu,Ni)(6)Sn-5 grains with a diameter of 100-200 nm are formed at the edge of the joint interface, which gradually transform into coarsely and loosely distributed rod-like (Cu,Ni)(6)Sn-5 grains from the edge to the inner of the solder joint. The CuNi layer is completely consumed at the inner region, and the diameter of the (Cu,Ni)(6)Sn-5 grain were constant at about 1 mu m. With longer soldering time, the width of the transition region between the fine and coarse (Cu,Ni)(6)Sn-5 grains decrease sharply from a few hundred micrometers to about 10 mu m, and the coarse rod-like (Cu,Ni)(6)Sn-5 grains distribute throughout all the joint interface. Tensile fracture of the Cu/SnCu/CuNi solder joints occurs around the (Cu,Ni)(6)Sn-5/CuNi interface at the edge and along the solder/Al or Al/Si interfaces at the inner region. The longer reaction time results in exhaustion of the CuNi layer, weakening of the bonding between the Al/Si/SnO2 films, and decreased joint strength from over 40 MPa to lower than 35 MPa.
学科主题	Engineering ; Materials Science ; Physics
内容类型	期刊论文
源URL	[http://ir.nimte.ac.cn/handle/174433/19942]
专题	2020专题
作者单位	Zhang, QK (corresponding author), Chinese Acad Sci, Key Lab Marine Mat & Related Technol, Zhejiang Key Lab Marine Mat & Protect Technol, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Peoples R China.
推荐引用方式 GB/T 7714	Zhang, Qingke,Hu, Fangqin,Song, Zhenlun. Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces[J]. JOURNAL OF ELECTRONIC MATERIALS,2020,49(5):3383-3390.
APA	Zhang, Qingke,Hu, Fangqin,&Song, Zhenlun.(2020).Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces.JOURNAL OF ELECTRONIC MATERIALS,49(5),3383-3390.
MLA	Zhang, Qingke,et al."Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces".JOURNAL OF ELECTRONIC MATERIALS 49.5(2020):3383-3390.