Reactive infiltration and microstructural characteristics of Sn-V active solder alloys on porous graphite

doi:10.3390/ma13071532

	Reactive infiltration and microstructural characteristics of Sn-V active solder alloys on porous graphite
	Zhang, Yubin 2; Liao, Xinjiang 2; Lin, Qiaoli 1; Mu, Dekui 2; Lu, Jing 2; Huang, Hui 2; Huang, Han 3
刊名	Materials
	2020-04-01
卷号	13 期号:7
关键词	Binary alloys Carbides Graphite Growth kinetics Infiltration Lead-free solders Magnetic bubbles Mass transfer Reaction kinetics Tin compounds Vanadium compounds Wetting Apparent contact angle Micro-structural characteristics Micro-structural characterization Porous graphite Quasi-equilibrium state Reactive infiltration Reactive wetting Three-phase contact line
DOI	10.3390/ma13071532
英文摘要	In this work, the reactive wetting and infiltration behaviors of a newly designed Sn-V binary alloy were comprehensively explored on porous graphite for the first time. It was discovered that 0.5 wt. % addition of V can obviously improve the wettability of liquid Sn on porous graphite and the nominal V contents in Sn-V binary alloys has minor effects on the apparent contact angles wetted at 950 °C. Moreover, the V-containing Sn-V alloys were initiated to spread on porous graphite at ~650 °C and reached a quasi-equilibrium state at ~900 °C. Spreading kinetics of Sn-3V alloy on porous graphite well fitted in the classic product reaction controlled (PRC) model. However, our microstructural characterization demonstrated that, besides vanadium carbide formation, the adsorption of V element at the wetting three-phase contact line spontaneously contributed to the reactive spreading and infiltrating of Sn-V alloys on porous graphite. Meanwhile, the formation of continuous vanadium carbides could completely block the infiltration of Sn-V active solder alloy in porous graphite. Affected by the growth kinetics of vanadium carbides, the infiltration depth of Sn-V alloys in porous graphite decreased at increased isothermal wetting temperatures. This work is believed to provide implicative notions on the fabrication of graphite related materials and devices using novel V-containing bonding alloys. © 2020 by the authors.
WOS研究方向	Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering ; Physics
语种	英语
出版者	MDPI AG
WOS记录号	WOS:000529875600050
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/115659]
专题	材料科学与工程学院
作者单位	1.School of Materials Science and Engineering, Lanzhou University of Technology, Lanzhou; 730000, China; 2.Institute of Manufacturing Engineering, Huaqiao University, Xiamen; 361021, China; 3.School of Mechanical and Mining Engineering, University of Queensland, QLD; 4072, Australia
推荐引用方式 GB/T 7714	Zhang, Yubin,Liao, Xinjiang,Lin, Qiaoli,et al. Reactive infiltration and microstructural characteristics of Sn-V active solder alloys on porous graphite[J]. Materials,2020,13(7).
APA	Zhang, Yubin.,Liao, Xinjiang.,Lin, Qiaoli.,Mu, Dekui.,Lu, Jing.,...&Huang, Han.(2020).Reactive infiltration and microstructural characteristics of Sn-V active solder alloys on porous graphite.Materials,13(7).
MLA	Zhang, Yubin,et al."Reactive infiltration and microstructural characteristics of Sn-V active solder alloys on porous graphite".Materials 13.7(2020).