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浏览/检索结果: 共14条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Form-stable phase change materials enhanced photothermic conversion and thermal conductivity by Ag-expanded graphite 期刊论文 Journal of Energy Storage, 2022, 卷号: 52 作者:  Luo, Wenxing;  Hu, Xiaowu;  Che, Yinhui;  Zu, Shuai;  Li, Qinglin 收藏  |  浏览/下载：27/0  |  提交时间：2022/07/20 Blending  Energy conversion  Epoxy resins  Graphite  Heat storage  Metal nanoparticles  Phase change materials  Solar energy  Storage (materials)  Thermal conductivity  Ag nanoparticle modification  EP matrix  Expanded graphite  Form stable phase change material  Heat absorption  Leakage problems  Photothermics  Solar energy conversion capability  Solar energy conversions  Solar energy storages   Research on Bi contents addition into Sn-Cu-based lead-free solder alloy 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603 作者:  Huang, Hai;  Chen, Bin;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin 收藏  |  浏览/下载：87/0  |  提交时间：2022/07/19 Binary alloysCopper corrosionCorrosion protectionCorrosion resistanceCorrosion resistant alloysCorrosive effectsDifferential scanning calorimetryElectrochemical corrosionElectrochemical impedance spectroscopyLead alloysLead-free soldersPassivationScanning electron microscopySemiconductor dopingTensile strengthThermodynamic propertiesTin alloysVickers hardness  Cu-basedElectrochemicalsLead-free solder alloyMechanical performanceMechanical resistanceSolder alloysUndercoolingsUniversal testing machinesVicker hardnessX- ray diffractions   Enhanced thermal performance of phase change materials supported by hierarchical porous carbon modified with polydopamine/nano-Ag for thermal energy storage 期刊论文 Journal of Energy Storage, 2022, 卷号: 49 作者:  Xiao, Shikun;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin 收藏  |  浏览/下载：32/0  |  提交时间：2022/04/21 Carbon  Chemical analysis  Chemical stability  Heat storage  Image enhancement  Metal nanoparticles  Silver nanoparticles  Sodium bicarbonate  Thermal conductivity  Thermal energy  Carbon-based  Composites material  Hierarchical porous carbons  Phase Change  Photo-thermal conversion capability  Photothermal conversion  Polydopamine  Polydopamine modification  Shape-stabilized  Thermal energy storage   Nano-Ag modified bio-based shape-stable phase change material for thermal energy storage 期刊论文 International Journal of Energy Research, 2022 作者:  Ma, Yan;  Zou, Minming;  Chen, Wenjing;  Xiao, Shikun;  Luo, Wenxing 收藏  |  浏览/下载：22/0  |  提交时间：2022/09/22 Conversion efficiency  Electric energy storage  Energy policy  Heat storage  Magnetic storage  Metal nanoparticles  Porous materials  Silver nanoparticles  Solar energy  Storage (materials)  Thermal conductivity  Thermal energy  Bio-based  Bio-based shape-stable phase change material  Cyperus alternifolius  Energy crisis  Latent heat storage  Photothermal conversion  Silver nanoparticle modification  Solar energy storages  Stable phasis  Thermal energy storage   Enhanced mechanical properties and corrosion behavior of Zn-30Sn-2Cu high-temperature lead-free solder alloy by adding Sm 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 9, 页码: 6469-6484 作者:  Zhang, Huajin;  Hu, Xiaowu;  Liu, Yi;  Zhang, Jiankang;  Jiang, Xiongxin 收藏  |  浏览/下载：27/0  |  提交时间：2022/03/01 Corrosion resistance  Corrosion resistant alloys  Corrosive effects  Ductile fracture  Electrochemical impedance spectroscopy  Galvanic corrosion  High temperature corrosion  Lead-free solders  Morphology  Tensile strength  Zinc  Zinc alloys  Corrosion behaviour  Electrochemical-impedance spectroscopies  Fracture morphology  Highest temperature  Lead-free solder alloy  Polarization impedance  Potentiodynamics polarization  Rich phase  Sm addition  Ultimate tensile strength   Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid-liquid electromigration 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348 作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin 收藏  |  浏览/下载：17/0  |  提交时间：2021/10/14 Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文 Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348 作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin 收藏  |  浏览/下载：12/0  |  提交时间：2022/02/17 Binary alloys  Copper alloys  Electromigration  Tensile strength  Tin alloys  Bonding joints  Co content  Coaddition  Current direction  Electric density  Micro-structure evolutions  Solder joints   Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint 期刊论文 Applied Physics A: Materials Science and Processing, 2020, 卷号: 126, 期号: 4 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin;  Jiang, Xiongxin 收藏  |  浏览/下载：4/0  |  提交时间：2020/11/14 Ductile fracture  Microstructure  Soldering  Fracture mechanisms  IMC layer  Liquid-state reaction  Micro-structure evolutions  Ni additions  Reflow--soldering  Solder joints  Synergistic effect   Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 3, 页码: 2320-2330 作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Zhou, Liuru;  Li, Qinglin 收藏  |  浏览/下载：11/0  |  提交时间：2020/06/16 Additives  Atomic force microscopy  Binary alloys  Chlorine compounds  Copper  Copper compounds  Electron probe microanalysis  Electrons  High resolution transmission electron microscopy  Metallic films  Scanning electron microscopy  Tin alloys  Tin metallography  X ray photoelectron spectroscopy  Crystallographic orientations  Electron back scatter diffraction  Electroplated copper film  Electroplated Cu films  Impurity incorporation  Micro-structural characterization  Microstructural instability  Plating solutions   The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration 期刊论文 MATERIALS LETTERS, 2019, 卷号: 256 作者:  Qiu, Hongyu;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin 收藏  |  浏览/下载：14/0  |  提交时间：2019/11/15 Grain orientation  Electromigration  Intermetallic compounds  Diffusion