CORC

在结果中检索

CORC

浏览/检索结果: 共97条，第1-10条 帮助

已选(0)清除 条数/页：   排序方式：
High-quality dissimilar friction stir welding of Al to steel with no contacting between tool and steel plate 期刊论文
MATERIALS CHARACTERIZATION, 2022, 卷号: 191, 页码: 7
作者:  Zhang, M.;  Wang, Y. D.;  Xue, P.;  Zhang, H.;  Ni, D. R.
收藏  |  浏览/下载：24/0  |  提交时间：2022/09/16
Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20
作者:  Zhang, Sinan;  Wang Z(王臻);  Wang, Jie;  Duan GH(段桂花);  Li, Haixia
收藏  |  浏览/下载：20/0  |  提交时间：2022/08/22
Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11
作者:  Chen, Yinbo;  Wang, Changchang;  Gao, Yue;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：16/0  |  提交时间：2022/01/27
Plasma arc welding-brazing of aluminum to copper with SiO2 nanoparticles strengthening 期刊论文
JOURNAL OF MANUFACTURING PROCESSES, 2021, 卷号: 69, 页码: 253-260
作者:  Fan, Ding;  Yang, Nan;  Huang, Jiankang;  Yu, Xiaoquan
收藏  |  浏览/下载：3/0  |  提交时间：2021/10/14
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
作者:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：12/0  |  提交时间：2021/03/15
Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder 期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302
作者:  Yu, Weiyuan;  Sun, Jungang;  Liu, Yun;  B., Wu;  Z., Lei
收藏  |  浏览/下载：8/0  |  提交时间：2022/02/17
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong
收藏  |  浏览/下载：2/0  |  提交时间：2022/02/17
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong
收藏  |  浏览/下载：8/0  |  提交时间：2020/11/14
Effect of post-weld annealing on microstructure and growth behavior of copper/aluminum friction stir welded joint 期刊论文
Materials, 2020, 卷号: 13, 期号: 20, 页码: 1-17
作者:  Jin, Yuhua;  Wu, Bo;  Lu, Xuetian;  Xing, Yichu;  Zhou, Zizheng
收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14
The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文
MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6
作者:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang;  He, Xin
收藏  |  浏览/下载：69/0  |  提交时间：2021/02/02

©版权所有 ©2017 CSpace - Powered by CSpace