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CORC

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Interfacial reactions at Ga-21.5In-10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2022, 卷号: 282, 页码: 16
作者:  Gao, Zhaoqing;  Wang, Chen;  Chai, Zhenbang;  Chen, Yinbo
收藏  |  浏览/下载：24/0  |  提交时间：2022/07/14
Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly 期刊论文
ACTA METALLURGICA SINICA, 2020, 卷号: 56, 期号: 10, 页码: 1433-1440
作者:  Jiang Lin;  Zhang Liang;  Liu Zhiquan
收藏  |  浏览/下载：36/0  |  提交时间：2021/02/02
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：46/0  |  提交时间：2021/02/02
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：42/0  |  提交时间：2021/02/02
Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 14, 页码: 11470-11481
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Zhang, Zhe;  Li, Qinglin
收藏  |  浏览/下载：5/0  |  提交时间：2020/11/14
Development and Test Results of a Full-Size Joint Sample for the CFETR Central Solenoid Model Coil 期刊论文
IEEE TRANSACTIONS ON PLASMA SCIENCE, 2020, 卷号: 48
作者:  Ma, Guanghui;  Wu, Yu;  Qin, Jinggang;  Liu, Huajun;  Hao, Qiangwang
收藏  |  浏览/下载：84/0  |  提交时间：2020/10/26
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
作者:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
收藏  |  浏览/下载：21/0  |  提交时间：2021/02/02
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
作者:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
收藏  |  浏览/下载：10/0  |  提交时间：2021/02/02
Formation and evolution of IMCs layer at Cu/Sn solid-liquid interface by ultrasonic assisted soldering 期刊论文
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2019, 卷号: 29, 期号: 4, 页码: 764-771
作者:  Yu, Wei-Yuan;  Liu, Ying-Zong;  Wu, Wei-Jie;  Li, Fu-Xiang;  Xing, Chun-Xiao
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14

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