Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints

doi:10.1007/s10854-019-02483-7

	Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints
	Yi, Xiong 1; Yi, Guangbin 1; Hu, Xiaowu 1; Li, Qinglin 2; Zhang, Ruhua 1
刊名	Journal of Materials Science: Materials in Electronics
	2019-12-01
卷号	30 期号:24 页码:21126-21137
关键词	Atomic force microscopy Coatings Copper compounds Electroplating Gold Growth rate Lead-free solders Metallic films Scanning electron microscopy Semiconductor doping Silver alloys Silver metallography Soldering Substrates Surface roughness Ternary alloys Thermal aging Tin alloys Tin compounds Tin metallography X ray photoelectron spectroscopy Benzotriazole(BTA) Electroplated Cu films Heterocyclic compound Interfacial microstructure evolution Isothermal aging Kovar substrates Low concentrations Soldering process
ISSN号	09574522
DOI	10.1007/s10854-019-02483-7
英文摘要	Benzotriazole (BTA), a nitrogen-containing heterocyclic compound, was employed as a leveler to prepare Cu film. During electroplating, the concentrations of BTA were 0, 10, 20, 50, and 100 ppm. After electroplating, the Cu substrates were soldered by dip soldering with Sn3.0Ag0.5Cu (SAC305) solder at 250 °C for 10 s, then isothermal aging was conducted at 180 °C up to 240 h. The electroplated Cu (EPC) films and solder joints were characterized by scanning electron microscope (SEM), atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS), and uniaxial micro-force test system. Experimental results showed that high concentration BTA (≥ 50 ppm) would lead to a reduction in the thickness of the EPC film. The surface roughness of the EPC film increased at first and then decreased with increasing BTA concentration. Additionally, the XPS patterns indicates that the Cu(I)-BTA complex could form on the copper surface. After soldering and thermal aging, for sample with low concentration of BTA (≤ 20 ppm), Cu–Sn intermetallic compound (IMC) was observed between the SAC305 solder and substrate. However, when the BTA concentration increased to 50 and 100 ppm. The Au coating and the Ni coating on the Kovar substrate would participate in interfacial reaction during the dip soldering process, resulting in the formation of single (Ni, Au, Cu)6Sn5 layer. The growth rate of the (Ni, Au, Cu)6Sn5 IMC was significantly lower than that of the Cu–Sn IMCs. Moreover, the incorporated impurities segregated and the doping of Au and Ni resulted in the decrease of shear strength at first and then increase as the BTA concentration increased. © 2019, Springer Science+Business Media, LLC, part of Springer Nature.
WOS研究方向	Engineering ; Materials Science ; Physics
语种	英语
出版者	Springer
WOS记录号	WOS:000496275400014
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/114050]
专题	材料科学与工程学院
作者单位	1.School of Mechanical & Electrical Engineering, Nanchang University, Nanchang; 330031, China; 2.State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou; 730050, China
推荐引用方式 GB/T 7714	Yi, Xiong,Yi, Guangbin,Hu, Xiaowu,et al. Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints[J]. Journal of Materials Science: Materials in Electronics,2019,30(24):21126-21137.
APA	Yi, Xiong,Yi, Guangbin,Hu, Xiaowu,Li, Qinglin,&Zhang, Ruhua.(2019).Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints.Journal of Materials Science: Materials in Electronics,30(24),21126-21137.
MLA	Yi, Xiong,et al."Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints".Journal of Materials Science: Materials in Electronics 30.24(2019):21126-21137.