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CORC

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Research on Bi contents addition into Sn-Cu-based lead-free solder alloy 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603
作者:  Huang, Hai;  Chen, Bin;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin
收藏  |  浏览/下载：87/0  |  提交时间：2022/07/19
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid-liquid electromigration 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：17/0  |  提交时间：2021/10/14
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：12/0  |  提交时间：2022/02/17
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
作者:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：12/0  |  提交时间：2021/03/15
Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262
作者:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.
收藏  |  浏览/下载：25/0  |  提交时间：2021/02/03
Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs 期刊论文
Vacuum, 2020, 卷号: 180
作者:  Qiu, Hongyu;  Hu, Xiaowu;  Li, Shuang;  Wan, Yongqiang;  Li, Qinglin
收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14
Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 51, 页码: 40-53
作者:  Wang, Mingna;  Qiao, Chuang;  Jiang, Xiaolin;  Hao, Long;  Liu, Xiahe
收藏  |  浏览/下载：12/0  |  提交时间：2021/02/02
Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 51, 页码: 40-53
作者:  Wang, Mingna;  Qiao, Chuang;  Jiang, Xiaolin;  Hao, Long;  Liu, Xiahe
收藏  |  浏览/下载：18/0  |  提交时间：2021/02/02
The open-pin failure of power device under the combined effect of thermo-migration and electro-migration 期刊论文
Chinese Science Bulletin, 2020, 卷号: 65, 期号: 20, 页码: 2169-2177
作者:  Gao Liyin;  Li Caifu;  Cao Lihua;  Liu Zhiquan
收藏  |  浏览/下载：15/0  |  提交时间：2021/02/03
锡在Cu6Sn5金属间化合物表面的润湿行为 期刊论文
焊接学报, 2020, 期号: 2020-03, 页码: 33-37+98-99
作者:  李富祥;  王建斌;  叶长胜;  林巧力
收藏  |  浏览/下载：2/0  |  提交时间：2020/12/18

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