Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering | |
Yu, Weiyuan; Liu, Yingzong; Liu, Yun | |
刊名 | Journal of Electronic Materials |
2019-09-15 | |
卷号 | 48期号:9页码:5595-5602 |
关键词 | Binary alloys Copper compounds Interface states Intermetallics Lead-free solders Microstructure Phase interfaces Soldering Tin compounds Ultrasonic effects Unmanned aerial vehicles (UAV) Formation and evolutions Growth patterns IMC layer Interfacial intermetallics Liquid interface Nonequilibrium state Ultrasonic vibration |
ISSN号 | 03615235 |
DOI | 10.1007/s11664-019-07405-1 |
英文摘要 | Interfacial intermetallic compounds (IMCs) help determine the reliability of soldered joints; thus, it is necessary to understand their formation and evolution. This study focus on Cu-Sn IMCs formed in ultrasonic-assisted soldering (UAS), wherein the formation of IMCs at the Sn/Cu interface is controlled by changing the ultrasonic action time. After being subjected to ultrasonic vibration, the IMCs at the Cu/Sn solid–liquid interface are continuously crushed, dissolved, and formed, which occurs successively in the Cu6Sn5 and Cu3Sn layers. The relationship between the thickness of the IMC layer and ultrasonic action time in Cu-Sn samples was identified. Simultaneously, the growth pattern of Cu6Sn5 grains in the Sn solder is transformed, and the tin solder (Sn solder) is kept in a dynamic non-equilibrium state with IMCs at the Sn/Cu interface through UAS. More Cu6Sn5 grains formed and were evenly distributed in the joint after cooling, which improves the performance of the joints. © 2019, The Minerals, Metals & Materials Society. |
WOS研究方向 | Engineering ; Materials Science ; Physics |
语种 | 英语 |
出版者 | Springer Science and Business Media, LLC |
WOS记录号 | WOS:000477974300025 |
内容类型 | 期刊论文 |
源URL | [http://ir.lut.edu.cn/handle/2XXMBERH/150486] |
专题 | 实验室建设与管理处 |
作者单位 | State Key Laboratory of Gansu Province, Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou; Gansu Province; 730050, China |
推荐引用方式 GB/T 7714 | Yu, Weiyuan,Liu, Yingzong,Liu, Yun. Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering[J]. Journal of Electronic Materials,2019,48(9):5595-5602. |
APA | Yu, Weiyuan,Liu, Yingzong,&Liu, Yun.(2019).Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering.Journal of Electronic Materials,48(9),5595-5602. |
MLA | Yu, Weiyuan,et al."Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering".Journal of Electronic Materials 48.9(2019):5595-5602. |
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