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兰州理工大学 [14]

武汉理工大学 [3]

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	Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文 Microelectronics Reliability, 2022, 卷号: 135 作者: Yu, Weiyuan; Li, Binbin; Wu, Baolei; Wang, Fengfeng; Wang, Mingkang 收藏 \| 浏览/下载：18/0 \| 提交时间：2022/08/09 Binary alloys Copper Copper alloys Indium alloys Lead-free solders Microstructure Shear flow Silicon carbide Soldering Temperature Thermoelectric equipment Wide band gap semiconductors Composite solders Electronics devices In-45cu composite solder paste Intermetallics compounds Microstructures and mechanical properties Service temperature Shears strength Solderpaste Ultrasonic action time Ultrasonic-assisted TLP
	Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者: Sun, Xuemin; Yu, Weiyuan; Wang, Yanhong 收藏 \| 浏览/下载：2/0 \| 提交时间：2022/02/17 Activation energy Copper Liquids Microelectronics Soldering Thermal gradients Tin Ultrasonics Copper dissolution Development trends Dissolution kinetics Dissolution rates Enhanced dissolutions Microelectronic products Multifunctionality Sound pressure distribution
	Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者: Sun, Xuemin; Yu, Weiyuan; Wang, Yanhong 收藏 \| 浏览/下载：8/0 \| 提交时间：2020/11/14 Activation energy Copper Liquids Microelectronics Soldering Thermal gradients Tin Ultrasonics Copper dissolution Development trends Dissolution kinetics Dissolution rates Enhanced dissolutions Microelectronic products Multifunctionality Sound pressure distribution
	Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文 Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81 作者: Liu, Yun; Yu, Weiyuan; Sun, Xuemin; Wang, Fengfeng 收藏 \| 浏览/下载：8/0 \| 提交时间：2022/02/17 Binary alloys Dissolution Electronics packaging Energy dispersive spectroscopy Intermetallics Lead-free solders Morphology Needles Scanning electron microscopy Shear flow Soldered joints Soldering Tin Tin alloys Tin metallography Ultrasonic effects Ultrasonic waves Uranium metallography Vanadium metallography Design/methodology/approach Dispersion strengthening Energy dispersive X ray spectroscopy Fractured surfaces Grain morphologies Grooves Ultrasonic cavitation Ultrasonic vibration
	Kinetics of dissolution of copper in liquid tin with ultrasonic waves 期刊论文 Materials Research, 2020, 卷号: 23, 期号: 1 作者: Sun, Xuemin; Yu, Weiyuan; Wu, Baolei; Yang, Guoqing 收藏 \| 浏览/下载：3/0 \| 提交时间：2020/11/14 Activation energy Copper Electronics packaging Liquids Tin Ultrasonic waves Dissolution behavior Dissolution rates Electronic Packaging IMC layer Immersion method Immersion time Ultrasonic power Welding method
	Kinetics of dissolution of copper in liquid tin with ultrasonic waves 期刊论文 Materials Research, 2020, 卷号: 23, 期号: 1 作者: Sun, Xuemin; Yu, Weiyuan; Wu, Baolei; Yang, Guoqing 收藏 \| 浏览/下载：4/0 \| 提交时间：2022/02/18 Activation energy Copper Electronics packaging Liquids Tin Ultrasonic waves
	Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文 SOLDERING & SURFACE MOUNT TECHNOLOGY, 2019, 卷号: 32, 期号: 2, 页码: 73-81 作者: Liu, Yun; Yu, Weiyuan; Sun, Xuemin; Wang, Fengfeng 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/06/16 Intermetallic compounds Grooves Ultrasonic vibration Dissolution IMC
	Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者: Yu, Weiyuan; Liu, Yingzong; Liu, Yun 收藏 \| 浏览/下载：5/0 \| 提交时间：2022/02/17 Binary alloys Copper compounds Interface states Intermetallics Lead-free solders Microstructure Phase interfaces Soldering Tin compounds Ultrasonic effects Unmanned aerial vehicles (UAV) Formation and evolutions Growth patterns IMC layer Interfacial intermetallics Liquid interface Nonequilibrium state Ultrasonic vibration
	Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者: Yu, Weiyuan; Liu, Yingzong; Liu, Yun 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/11/15 Ultrasonic-assisted soldering interfacial intermetallic compounds microstructure tin solder
	Formation and evolution of IMCs layer at Cu/Sn solid-liquid interface by ultrasonic assisted soldering 期刊论文 Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2019, 卷号: 29, 期号: 4, 页码: 764-771 作者: Yu, Wei-Yuan; Liu, Ying-Zong; Wu, Wei-Jie; Li, Fu-Xiang; Xing, Chun-Xiao 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/14 Binary alloys Brazing Copper compounds Diffusion Dissolution Intermetallics Lead-free solders Phase interfaces Tin alloys Tin compounds Cu-Sn intermetallics Dissolution model Evolution of the microstructure Formation and evolutions Formation mechanism Planar shape Soldering process Solid-liquid interfaces

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