Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering

doi:10.1007/s11664-019-07405-1

	Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering
	Yu, Weiyuan; Liu, Yingzong; Liu, Yun
刊名	JOURNAL OF ELECTRONIC MATERIALS
	2019-09
卷号	48 期号:9 页码:5595-5602
关键词	Ultrasonic-assisted soldering interfacial intermetallic compounds microstructure tin solder
ISSN号	0361-5235
DOI	10.1007/s11664-019-07405-1
英文摘要	Interfacial intermetallic compounds (IMCs) help determine the reliability of soldered joints; thus, it is necessary to understand their formation and evolution. This study focus on Cu-Sn IMCs formed in ultrasonic-assisted soldering (UAS), wherein the formation of IMCs at the Sn/Cu interface is controlled by changing the ultrasonic action time. After being subjected to ultrasonic vibration, the IMCs at the Cu/Sn solid-liquid interface are continuously crushed, dissolved, and formed, which occurs successively in the Cu6Sn5 and Cu3Sn layers. The relationship between the thickness of the IMC layer and ultrasonic action time in Cu-Sn samples was identified. Simultaneously, the growth pattern of Cu6Sn5 grains in the Sn solder is transformed, and the tin solder (Sn solder) is kept in a dynamic non-equilibrium state with IMCs at the Sn/Cu interface through UAS. More Cu6Sn5 grains formed and were evenly distributed in the joint after cooling, which improves the performance of the joints.
资助项目	National Natural Science Foundation of China[51465032][51665031]
WOS研究方向	Engineering ; Materials Science ; Physics
语种	英语
出版者	SPRINGER
WOS记录号	WOS:000477974300025
状态	已发表
内容类型	期刊论文
源URL	[http://119.78.100.223/handle/2XXMBERH/31590]
专题	实验室建设与管理处
通讯作者	Yu, Weiyuan
作者单位	Lanzhou Univ Technol, State Key Lab Gansu Prov, Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Gansu, Peoples R China
推荐引用方式 GB/T 7714	Yu, Weiyuan,Liu, Yingzong,Liu, Yun. Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering[J]. JOURNAL OF ELECTRONIC MATERIALS,2019,48(9):5595-5602.
APA	Yu, Weiyuan,Liu, Yingzong,&Liu, Yun.(2019).Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering.JOURNAL OF ELECTRONIC MATERIALS,48(9),5595-5602.
MLA	Yu, Weiyuan,et al."Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering".JOURNAL OF ELECTRONIC MATERIALS 48.9(2019):5595-5602.