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	Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文 Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348 作者: Qiu, Hongyu; Xu, Han; Zhang, Chuge; Hu, Xiaowu; Jiang, Xiongxin 收藏 \| 浏览/下载：12/0 \| 提交时间：2022/02/17 Binary alloys Copper alloys Electromigration Tensile strength Tin alloys Bonding joints Co content Coaddition Current direction Electric density Micro-structure evolutions Solder joints
	Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate 期刊论文 Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 1, 页码: 1073-1079 作者: Sun, Xuemin; Yu, Weiyuan; Wang, Fengfeng; Wang, Yanhong 收藏 \| 浏览/下载：13/0 \| 提交时间：2021/03/02 Copper Tin Ultrasonic effects Ultrasonic testing Ultrasonic waves Wetting Acoustic cavitations Additional forces Copper substrates Cross-section morphology Interfacial atoms Ultrasonic sound Ultrasonic vibration Wetting balance methods
	Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者: Sun, Xuemin; Yu, Weiyuan; Wang, Yanhong 收藏 \| 浏览/下载：2/0 \| 提交时间：2022/02/17 Activation energy Copper Liquids Microelectronics Soldering Thermal gradients Tin Ultrasonics Copper dissolution Development trends Dissolution kinetics Dissolution rates Enhanced dissolutions Microelectronic products Multifunctionality Sound pressure distribution
	Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者: Sun, Xuemin; Yu, Weiyuan; Wang, Yanhong 收藏 \| 浏览/下载：8/0 \| 提交时间：2020/11/14 Activation energy Copper Liquids Microelectronics Soldering Thermal gradients Tin Ultrasonics Copper dissolution Development trends Dissolution kinetics Dissolution rates Enhanced dissolutions Microelectronic products Multifunctionality Sound pressure distribution
	Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs 期刊论文 Vacuum, 2020, 卷号: 180 作者: Qiu, Hongyu; Hu, Xiaowu; Li, Shuang; Wan, Yongqiang; Li, Qinglin 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/11/14 Binary alloys Copper alloys Elastic moduli Fracture Fracture mechanics Shear flow Soldered joints Surface analysis Tin alloys Area ratios Fracture mechanisms Fracture surface analysis Fracture surfaces Fractured surfaces Isothermal aging Lead-free solder joint Solder joints
	Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint 期刊论文 Journal of Alloys and Compounds, 2020, 卷号: 832 作者: Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：20/0 \| 提交时间：2020/11/14 Bismuth compounds Diffusion Electric resistance Electrodes Growth rate IV-VI semiconductors Microstructure Scanning electron microscopy Tin Tin compounds Transmission electron microscopy Diffusion process Electrical resistances Micro-structure evolutions Porous structures Thermodynamically stable Thermoelectric Volume diffusion X ray diffractometers
	Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders 期刊论文 Microelectronics Reliability, 2020, 卷号: 111 作者: Lin, Qiaoli; Ye, Changsheng; Sui, Ran 收藏 \| 浏览/下载：3/0 \| 提交时间：2020/11/14 Amorphous alloys Binary alloys Copper alloys Lead alloys Nickel oxide Oxide films Silver alloys Ternary alloys Tin Crystalline alloys Interfacial reactivity Minimum surfaces Primary crystallization Sn-based solders Volume shrinkage Wetting balance methods Wetting mechanism
	Effect of Ultrasound on Dissolution Acceleration Behavior of Ni/Sn 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 7, 页码: 2365-2371 作者: Liu, Yun; Yu, Weiyuan; Sun, Jungang; Sun, Xuemin; Wang, Fengfeng 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/11/14 Binary alloys Dissolution Nickel Tin Ultrasonic effects Acceleration behavior Dissolution behavior Holding time Molten solders Rod-shaped Subsequent cooling Ultrasonic cavitation Ultrasonic vibration
	Effect of Ultrasound on Dissolution Acceleration Behavior of Ni/Sn 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 7, 页码: 2365-2371 作者: Liu, Yun; Yu, Weiyuan; Sun, Jungang; Sun, Xuemin; Wang, Fengfeng 收藏 \| 浏览/下载：4/0 \| 提交时间：2022/02/17 Binary alloys Dissolution Nickel Tin Ultrasonic effects Acceleration behavior Dissolution behavior Holding time Molten solders Rod-shaped Subsequent cooling Ultrasonic cavitation Ultrasonic vibration
	Wettability of amorphous and crystalline Co73Si10B17 by lead-free solders 期刊论文 Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2020, 卷号: 30, 期号: 6, 页码: 1329-1337 作者: Ye, Chang-Sheng; Ci, Wen-Juan; Lin, Qiao-Li; Sui, Ran; Wang, Jian-Bin 收藏 \| 浏览/下载：3/0 \| 提交时间：2020/11/14 Binary alloys Cobalt alloys Copper alloys Descaling Free energy Lead-free solders Oxide films Silicon Silicon compounds Silver alloys Surface reactions Ternary alloys Tin Wetting Co-based alloys Crystalline state Sn-based solders Surface free energy Surface oxide films Temperature range Wetting balance methods Wetting mechanism

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