Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint

doi:10.1108/SSMT-05-2019-0018

	Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint
	Liu, Yun; Yu, Weiyuan; Sun, Xuemin; Wang, Fengfeng
刊名	SOLDERING & SURFACE MOUNT TECHNOLOGY
	2019-11-16
卷号	32 期号:2 页码:73-81
关键词	Intermetallic compounds Grooves Ultrasonic vibration Dissolution IMC
ISSN号	0954-0911
DOI	10.1108/SSMT-05-2019-0018
英文摘要	Purpose
资助项目	National Natural Science Foundation of China[51465032]
WOS研究方向	Engineering ; Materials Science ; Metallurgy & Metallurgical Engineering
语种	英语
出版者	EMERALD GROUP PUBLISHING LTD
WOS记录号	WOS:000525226600001
状态	已发表
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/76641]
专题	实验室建设与管理处省部共建有色金属先进加工与再利用国家重点实验室
通讯作者	Yu, Weiyuan
作者单位	Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou, Peoples R China
推荐引用方式 GB/T 7714	Liu, Yun,Yu, Weiyuan,Sun, Xuemin,et al. Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint[J]. SOLDERING & SURFACE MOUNT TECHNOLOGY,2019,32(2):73-81.
APA	Liu, Yun,Yu, Weiyuan,Sun, Xuemin,&Wang, Fengfeng.(2019).Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint.SOLDERING & SURFACE MOUNT TECHNOLOGY,32(2),73-81.
MLA	Liu, Yun,et al."Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint".SOLDERING & SURFACE MOUNT TECHNOLOGY 32.2(2019):73-81.