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浏览/检索结果: 共16条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文 Microelectronics Reliability, 2022, 卷号: 135 作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang 收藏  |  浏览/下载：18/0  |  提交时间：2022/08/09 Binary alloys  Copper  Copper alloys  Indium alloys  Lead-free solders  Microstructure  Shear flow  Silicon carbide  Soldering  Temperature  Thermoelectric equipment  Wide band gap semiconductors  Composite solders  Electronics devices  In-45cu composite solder paste  Intermetallics compounds  Microstructures and mechanical properties  Service temperature  Shears strength  Solderpaste  Ultrasonic action time  Ultrasonic-assisted TLP   Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文 Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81 作者:  Liu, Yun;  Yu, Weiyuan;  Sun, Xuemin;  Wang, Fengfeng 收藏  |  浏览/下载：8/0  |  提交时间：2022/02/17 Binary alloys  Dissolution  Electronics packaging  Energy dispersive spectroscopy  Intermetallics  Lead-free solders  Morphology  Needles  Scanning electron microscopy  Shear flow  Soldered joints  Soldering  Tin  Tin alloys  Tin metallography  Ultrasonic effects  Ultrasonic waves  Uranium metallography  Vanadium metallography  Design/methodology/approach  Dispersion strengthening  Energy dispersive X ray spectroscopy  Fractured surfaces  Grain morphologies  Grooves  Ultrasonic cavitation  Ultrasonic vibration   Kinetics of dissolution of copper in liquid tin with ultrasonic waves 期刊论文 Materials Research, 2020, 卷号: 23, 期号: 1 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wu, Baolei;  Yang, Guoqing 收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14 Activation energy  Copper  Electronics packaging  Liquids  Tin  Ultrasonic waves  Dissolution behavior  Dissolution rates  Electronic Packaging  IMC layer  Immersion method  Immersion time  Ultrasonic power  Welding method   Kinetics of dissolution of copper in liquid tin with ultrasonic waves 期刊论文 Materials Research, 2020, 卷号: 23, 期号: 1 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wu, Baolei;  Yang, Guoqing 收藏  |  浏览/下载：4/0  |  提交时间：2022/02/18 Activation energy  Copper  Electronics packaging  Liquids  Tin  Ultrasonic waves   Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun 收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17 Binary alloys  Copper compounds  Interface states  Intermetallics  Lead-free solders  Microstructure  Phase interfaces  Soldering  Tin compounds  Ultrasonic effects  Unmanned aerial vehicles (UAV)  Formation and evolutions  Growth patterns  IMC layer  Interfacial intermetallics  Liquid interface  Nonequilibrium state  Ultrasonic vibration   Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun 收藏  |  浏览/下载：2/0  |  提交时间：2019/11/15 Ultrasonic-assisted soldering  interfacial intermetallic compounds  microstructure  tin solder   Formation and evolution of IMCs layer at Cu/Sn solid-liquid interface by ultrasonic assisted soldering 期刊论文 Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2019, 卷号: 29, 期号: 4, 页码: 764-771 作者:  Yu, Wei-Yuan;  Liu, Ying-Zong;  Wu, Wei-Jie;  Li, Fu-Xiang;  Xing, Chun-Xiao 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Binary alloys  Brazing  Copper compounds  Diffusion  Dissolution  Intermetallics  Lead-free solders  Phase interfaces  Tin alloys  Tin compounds  Cu-Sn intermetallics  Dissolution model  Evolution of the microstructure  Formation and evolutions  Formation mechanism  Planar shape  Soldering process  Solid-liquid interfaces   Microstructure of Ultrasonic-assisted Soldering Mg/Al Dissimilar Metal Joints 期刊论文 RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 10, 页码: 3197-3202 作者:  Yu Weiyuan;  Gao Mengzhao;  Zhang Tianyu;  Shang Jiangxu;  Yan Zehua 收藏  |  浏览/下载：0/0  |  提交时间：2019/11/15 Mg alloy  Al alloy  soldering  ultrasonic-assisted   Microstructure of Ultrasonic-assisted Soldering Mg/Al Dissimilar Metal Joints 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2018, 卷号: 47, 期号: 10, 页码: 3197-3202 作者:  Yu, Weiyuan;  Gao, Mengzhao;  Zhang, Tianyu;  Shang, Jiangxu;  Yan, Zehua 收藏  |  浏览/下载：3/0  |  提交时间：2022/02/17 Aluminum alloys  Aluminum compounds  Aluminum metallography  Binary alloys  Fillers  Grain boundaries  Intermetallics  Magnesium alloys  Magnesium compounds  Magnesium metallography  Metals  Microstructure  Silver metallography  Soldering alloys  Ternary alloys  Tin alloys  Tin metallography  Zinc alloys  Zinc metallography  6063 Al alloy  Al-alloy  Al-Sn-Zn  Dissimilar metal joints  Large amounts  Low melting point  Mg alloy  Second phase   Spreading of Sn-Ag-Ti and Sn-Ag-Ti(-Al) solder droplets on the surface of porous graphite through ultrasonic vibration 期刊论文 MATERIALS & DESIGN, 2018, 卷号: 150, 页码: 9-16 作者:  Yu, Weiyuan;  Liu, Yun;  Liu, Xinya 收藏  |  浏览/下载：3/0  |  提交时间：2019/11/15 Graphite  Active solder  Spreading  Ultrasonic-assisted soldering