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CORC

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Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang
收藏  |  浏览/下载：18/0  |  提交时间：2022/08/09
Effect of Ultrasonic Vibration Coupled with Direct Current on Wetting Behavior 期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2022, 卷号: 51, 期号: 3, 页码: 800-805
作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Fengfeng;  Wu, Baolei;  Wang, Yanhong
收藏  |  浏览/下载：20/0  |  提交时间：2022/06/20
Progress in Functional Research of Amorphous Alloys 期刊论文
Xiyou Jinshu/Chinese Journal of Rare Metals, 2021, 卷号: 45, 期号: 8, 页码: 998-1009
作者:  Tian, Lin;  Li, Chunyan;  Zhai, Jianshu;  Lu, Yu;  Kou, Shengzhong
收藏  |  浏览/下载：27/0  |  提交时间：2022/02/17
Amorphous alloys  Asphalt pavements  Atoms  Biological water treatment  Biomimetics  Casting  Catalyst activity  Cobalt alloys  Corrosion resistance  Corrosion resistant alloys  Crystal atomic structure  Crystals  Electrodes  Electronics industry  Fuel cells  Functional materials  Grain boundaries  Hardness  Heat conduction  Hydrogen storage  Hydrogen storage alloys  Industrial emissions  Industrial research  Industrial water treatment  Ion beams  Magnetism  Marine communication  Metallic glass  Nanocrystalline materials  Phase composition  Porous materials  Satellite antennas  Shape-memory alloy  Silicon steel  Sputtering  Strontium alloys  Structural properties  Sustainable development  Temperature  Wastewater treatment  Wear resistance  Amorphous alloy catalyst  Co-based amorphous alloys  Comprehensive performance  Comprehensive properties  Development of science and technologies  Electronic manufacturing  Liquid phase compositions  Low temperature performance  
Reactive infiltration and microstructural characteristics of Sn-V active solder alloys on porous graphite 期刊论文
Materials, 2020, 卷号: 13, 期号: 7
作者:  Zhang, Yubin;  Liao, Xinjiang;  Lin, Qiaoli;  Mu, Dekui;  Lu, Jing
收藏  |  浏览/下载：5/0  |  提交时间：2020/11/14
Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390
作者:  Zhang, Qingke;  Hu, Fangqin;  Song, Zhenlun
收藏  |  浏览/下载：114/0  |  提交时间：2020/12/16
Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602
作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun
收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17
Formation and evolution of IMCs layer at Cu/Sn solid-liquid interface by ultrasonic assisted soldering 期刊论文
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2019, 卷号: 29, 期号: 4, 页码: 764-771
作者:  Yu, Wei-Yuan;  Liu, Ying-Zong;  Wu, Wei-Jie;  Li, Fu-Xiang;  Xing, Chun-Xiao
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14
Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172(2016) 211-215] 期刊论文
Materials Letter, 2018, 卷号: 230, 页码: 76-76
作者:  A. Kunwar;  Ma HR(马浩然);  Ma HT(马海涛);  J.H. Sun;  Zhao N(赵宁)
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172 (2016) 211–215] (S0167577X16302397) (10.1016/j.matlet.2016.02.075)) 期刊论文
Materials Letters, 2018, 卷号: 230, 页码: 76
作者:  Kunwar, A.;  Ma, H.;  Sun, J.;  Zhao, N.;  Huang, M.
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient (vol 172, pg 211, 2016) 期刊论文
MATERIALS LETTERS, 2018, 卷号: 230, 页码: 76-76
作者:  Kunwar, Anil;  Ma, Haoran;  Ma, Haitao;  Sun, Junhao;  Zhao, Ning
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02

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