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	Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172 (2016) 211–215] (S0167577X16302397) (10.1016/j.matlet.2016.02.075))
	Kunwar, A.; Ma, H.; Sun, J.; Zhao, N.; Huang, M.
刊名	Materials Letters
	2018
卷号	230页码:76
ISSN号	0167577X
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3249192
专题	大连理工大学
作者单位	School of Materials Science and Engineering, Dalian University of Technology, Dalian, 116024, China
推荐引用方式 GB/T 7714	Kunwar, A.,Ma, H.,Sun, J.,et al. Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172 (2016) 211–215] (S0167577X16302397) (10.1016/j.matlet.2016.02.075))[J]. Materials Letters,2018,230:76.
APA	Kunwar, A.,Ma, H.,Sun, J.,Zhao, N.,&Huang, M..(2018).Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172 (2016) 211–215] (S0167577X16302397) (10.1016/j.matlet.2016.02.075)).Materials Letters,230,76.
MLA	Kunwar, A.,et al."Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172 (2016) 211–215] (S0167577X16302397) (10.1016/j.matlet.2016.02.075))".Materials Letters 230(2018):76.

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