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期刊论文 [47]
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Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:
Yu, Weiyuan
;
Li, Binbin
;
Wu, Baolei
;
Wang, Fengfeng
;
Wang, Mingkang
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2022/08/09
Binary alloys
Copper
Copper alloys
Indium alloys
Lead-free solders
Microstructure
Shear flow
Silicon carbide
Soldering
Temperature
Thermoelectric equipment
Wide band gap semiconductors
Composite solders
Electronics devices
In-45cu composite solder paste
Intermetallics compounds
Microstructures and mechanical properties
Service temperature
Shears strength
Solderpaste
Ultrasonic action time
Ultrasonic-assisted TLP
Effect of Ultrasonic Vibration Coupled with Direct Current on Wetting Behavior
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2022, 卷号: 51, 期号: 3, 页码: 800-805
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Fengfeng
;
Wu, Baolei
;
Wang, Yanhong
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2022/06/20
Copper
Intermetallics
Nanocomposites
Precipitation (chemical)
Ultrasonic applications
Ultrasonic waves
Wetting
Cu substrate
Direct current method
Direct-current
Driving forces
Intermetallics compounds
Liquid solders
Power current
Ultrasonic-vibration
Wetting balance
Wetting behavior
Progress in Functional Research of Amorphous Alloys
期刊论文
Xiyou Jinshu/Chinese Journal of Rare Metals, 2021, 卷号: 45, 期号: 8, 页码: 998-1009
作者:
Tian, Lin
;
Li, Chunyan
;
Zhai, Jianshu
;
Lu, Yu
;
Kou, Shengzhong
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2022/02/17
Amorphous alloys
Asphalt pavements
Atoms
Biological water treatment
Biomimetics
Casting
Catalyst activity
Cobalt alloys
Corrosion resistance
Corrosion resistant alloys
Crystal atomic structure
Crystals
Electrodes
Electronics industry
Fuel cells
Functional materials
Grain boundaries
Hardness
Heat conduction
Hydrogen storage
Hydrogen storage alloys
Industrial emissions
Industrial research
Industrial water treatment
Ion beams
Magnetism
Marine communication
Metallic glass
Nanocrystalline materials
Phase composition
Porous materials
Satellite antennas
Shape-memory alloy
Silicon steel
Sputtering
Strontium alloys
Structural properties
Sustainable development
Temperature
Wastewater treatment
Wear resistance
Amorphous alloy catalyst
Co-based amorphous alloys
Comprehensive performance
Comprehensive properties
Development of science and technologies
Electronic manufacturing
Liquid phase compositions
Low temperature performance
Reactive infiltration and microstructural characteristics of Sn-V active solder alloys on porous graphite
期刊论文
Materials, 2020, 卷号: 13, 期号: 7
作者:
Zhang, Yubin
;
Liao, Xinjiang
;
Lin, Qiaoli
;
Mu, Dekui
;
Lu, Jing
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2020/11/14
Binary alloys
Carbides
Graphite
Growth kinetics
Infiltration
Lead-free solders
Magnetic bubbles
Mass transfer
Reaction kinetics
Tin compounds
Vanadium compounds
Wetting
Apparent contact angle
Micro-structural characteristics
Micro-structural characterization
Porous graphite
Quasi-equilibrium state
Reactive infiltration
Reactive wetting
Three-phase contact line
Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390
作者:
Zhang, Qingke
;
Hu, Fangqin
;
Song, Zhenlun
收藏
  |  
浏览/下载:114/0
  |  
提交时间:2020/12/16
LEAD-FREE SOLDERS
INTERMETALLIC COMPOUNDS
LIQUID SN
KINETICS
GROWTH
CU6SN5
METALLIZATION
Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering
期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602
作者:
Yu, Weiyuan
;
Liu, Yingzong
;
Liu, Yun
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2022/02/17
Binary alloys
Copper compounds
Interface states
Intermetallics
Lead-free solders
Microstructure
Phase interfaces
Soldering
Tin compounds
Ultrasonic effects
Unmanned aerial vehicles (UAV)
Formation and evolutions
Growth patterns
IMC layer
Interfacial intermetallics
Liquid interface
Nonequilibrium state
Ultrasonic vibration
Formation and evolution of IMCs layer at Cu/Sn solid-liquid interface by ultrasonic assisted soldering
期刊论文
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2019, 卷号: 29, 期号: 4, 页码: 764-771
作者:
Yu, Wei-Yuan
;
Liu, Ying-Zong
;
Wu, Wei-Jie
;
Li, Fu-Xiang
;
Xing, Chun-Xiao
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2020/11/14
Binary alloys
Brazing
Copper compounds
Diffusion
Dissolution
Intermetallics
Lead-free solders
Phase interfaces
Tin alloys
Tin compounds
Cu-Sn intermetallics
Dissolution model
Evolution of the microstructure
Formation and evolutions
Formation mechanism
Planar shape
Soldering process
Solid-liquid interfaces
Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172(2016) 211-215]
期刊论文
Materials Letter, 2018, 卷号: 230, 页码: 76-76
作者:
A. Kunwar
;
Ma HR(马浩然)
;
Ma HT(马海涛)
;
J.H. Sun
;
Zhao N(赵宁)
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/02
Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172 (2016) 211–215] (S0167577X16302397) (10.1016/j.matlet.2016.02.075))
期刊论文
Materials Letters, 2018, 卷号: 230, 页码: 76
作者:
Kunwar, A.
;
Ma, H.
;
Sun, J.
;
Zhao, N.
;
Huang, M.
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/12/02
On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient (vol 172, pg 211, 2016)
期刊论文
MATERIALS LETTERS, 2018, 卷号: 230, 页码: 76-76
作者:
Kunwar, Anil
;
Ma, Haoran
;
Ma, Haitao
;
Sun, Junhao
;
Zhao, Ning
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
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