Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method

doi:10.1007/s40195-019-00875-6

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	Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method
	Jiang, Lin 1,2; Zhang, Liang 1,3; Liu, Zhi-Quan 1,2
刊名	ACTA METALLURGICA SINICA-ENGLISH LETTERS
	2019-11-01
卷号	32 期号:11 页码:1407-1414
关键词	Co target assembly Solder Residual stress Simulation Taguchi method Optimal design
ISSN号	1006-7191
DOI	10.1007/s40195-019-00875-6
通讯作者	Liu, Zhi-Quan(zqliu@imr.ac.cn)
英文摘要	Target assembly is a key consumable material for producing thin film used in the electronic packaging and devices. The residual stresses induced during the process of soldering are detrimental to the performance of target assembly. In this work, the intensity and distribution of the soldering residual stress of Co/In/Cu target assembly subjected to a 20 W/(m(2) K) cooling condition corresponding to the actual air cooling process were studied, based on finite element simulation and Taguchi method, to optimize the sputtering target assembly. Effects of different control factors, including solder material, thickness of solder layer, target and backing plate, on the soldering residual stress of target assembly are investigated. The maximum residual stress is calculated as 9.28 MPa in the target located at 0.16 mm from target-solder layer interface and at a distance of 0.78 mm from symmetry axis. The optimal design in target assembly has the combination of indium solder material, cobalt target at 12 mm thick, solder layer at 0.8 mm thick, copper backing plate at 15 mm thick. Moreover, solder material is the most important factor among control factors in the target assembly.
资助项目	National Key R&D Program of China[2017YFB0305501] ; National Natural Science Foundation of China[51475220] ; China Postdoctoral Science Foundation[2016M591464]
WOS研究方向	Metallurgy & Metallurgical Engineering
语种	英语
出版者	CHINESE ACAD SCIENCES, INST METAL RESEARCH
WOS记录号	WOS:000488930700011
资助机构	National Key R&D Program of China ; National Natural Science Foundation of China ; China Postdoctoral Science Foundation
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/135803]
专题	金属研究所_中国科学院金属研究所
通讯作者	Liu, Zhi-Quan
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 11016, Liaoning, Peoples R China 3.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China
推荐引用方式 GB/T 7714	Jiang, Lin,Zhang, Liang,Liu, Zhi-Quan. Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2019,32(11):1407-1414.
APA	Jiang, Lin,Zhang, Liang,&Liu, Zhi-Quan.(2019).Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method.ACTA METALLURGICA SINICA-ENGLISH LETTERS,32(11),1407-1414.
MLA	Jiang, Lin,et al."Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method".ACTA METALLURGICA SINICA-ENGLISH LETTERS 32.11(2019):1407-1414.