Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350 degrees C

doi:10.1007/s11664-019-07251-1

CORC > 兰州理工大学 > 兰州理工大学 > 省部共建有色金属先进加工与再利用国家重点实验室

	Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350 degrees C
	Sui, Ran 1; Li, Fuxiang 2; Ci, Wenjuan 2; Lin, Qiaoli 2
刊名	JOURNAL OF ELECTRONIC MATERIALS
	2019-07
卷号	48 期号:7 页码:4660-4668
关键词	Wettability soldering joining
ISSN号	0361-5235
DOI	10.1007/s11664-019-07251-1
英文摘要	Wetting of Cu and Sn-Cu intermetallics (IMCs) by molten Sn-Bi alloys with different interfacial reactivity was studied by the sessile drop method. The pre-formed IMC substrate has a better wettability, also it can be a method to control the thickness of the IMC layer as well as preventing Bi segregation, which is a potential way for optimizing mechanical property of joints. The evolution of interfacial structures, both of Sn-Bi/Cu and Sn-Bi/IMCs, can be verified from a Sn-Bi-Cu ternary phase diagram, and Bi segregation at an interface of Sn-Bi/Cu results from the saturated precipitation from solid solution rather than diffusion from liquid. The reaction of Sn with Cu2O (oxide film), both in a Sn/Cu system and a Sn-Bi/IMCs system, is the key for the occurrence of spreading, and the difference of reactivity caused the different spreading characteristics.
资助项目	National Natural Science Foundation of China[51665031][51675256] ; Program of Innovation Groups of Basic Research of Gansu Province[17JR5RA107] ; Foundation of Collaborative Innovation Teams in College of Gansu Province[2017C-07] ; Technology Innovation Project of Lanzhou Institute of Technology for Young Scientists[19K-019]
WOS研究方向	Engineering ; Materials Science ; Physics
语种	英语
出版者	SPRINGER
WOS记录号	WOS:000469889000060
状态	已发表
内容类型	期刊论文
源URL	[http://119.78.100.223/handle/2XXMBERH/31758]
专题	省部共建有色金属先进加工与再利用国家重点实验室材料科学与工程学院
通讯作者	Lin, Qiaoli
作者单位	1.Lanzhou Inst Technol, Dept Mat Sci & Engn, 1 Gongjiaping East Rd, Lanzhou 730050, Gansu, Peoples R China 2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, 287 Langongping Rd, Lanzhou 730050, Gansu, Peoples R China
推荐引用方式 GB/T 7714	Sui, Ran,Li, Fuxiang,Ci, Wenjuan,et al. Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350 degrees C[J]. JOURNAL OF ELECTRONIC MATERIALS,2019,48(7):4660-4668.
APA	Sui, Ran,Li, Fuxiang,Ci, Wenjuan,&Lin, Qiaoli.(2019).Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350 degrees C.JOURNAL OF ELECTRONIC MATERIALS,48(7),4660-4668.
MLA	Sui, Ran,et al."Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350 degrees C".JOURNAL OF ELECTRONIC MATERIALS 48.7(2019):4660-4668.