Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C

doi:10.1007/s11664-019-07251-1

	Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C
	Sui, Ran 1; Li, Fuxiang 2; Ci, Wenjuan 2; Lin, Qiaoli 2
刊名	Journal of Electronic Materials
	2019-07-15
卷号	48 期号:7 页码:4660-4668
关键词	Bismuth alloys Copper Copper oxides Joining Oxide films Phase interfaces Soldering Ternary alloys Tin compounds Wetting Cu intermetallics IMC layer Interfacial reactivity Interfacial structures Sessile drop method Sn-Bi alloy Spreading characteristics Ternary phase diagrams
ISSN号	03615235
DOI	10.1007/s11664-019-07251-1
英文摘要	Wetting of Cu and Sn-Cu intermetallics (IMCs) by molten Sn-Bi alloys with different interfacial reactivity was studied by the sessile drop method. The pre-formed IMC substrate has a better wettability, also it can be a method to control the thickness of the IMC layer as well as preventing Bi segregation, which is a potential way for optimizing mechanical property of joints. The evolution of interfacial structures, both of Sn-Bi/Cu and Sn-Bi/IMCs, can be verified from a Sn-Bi-Cu ternary phase diagram, and Bi segregation at an interface of Sn-Bi/Cu results from the saturated precipitation from solid solution rather than diffusion from liquid. The reaction of Sn with Cu2O (oxide film), both in a Sn/Cu system and a Sn-Bi/IMCs system, is the key for the occurrence of spreading, and the difference of reactivity caused the different spreading characteristics. © 2019, The Minerals, Metals & Materials Society.
WOS研究方向	Engineering ; Materials Science ; Physics
语种	英语
出版者	Springer New York LLC
WOS记录号	WOS:000469889000060
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/114044]
专题	材料科学与工程学院
作者单位	1.Department of Materials Science and Engineering, Lanzhou Institute of Technology, No. 1 Gongjiaping East Road, Lanzhou; 730050, China; 2.State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metal, Lanzhou University of Technology, No. 287 Langongping Road, Lanzhou; 730050, China
推荐引用方式 GB/T 7714	Sui, Ran,Li, Fuxiang,Ci, Wenjuan,et al. Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C[J]. Journal of Electronic Materials,2019,48(7):4660-4668.
APA	Sui, Ran,Li, Fuxiang,Ci, Wenjuan,&Lin, Qiaoli.(2019).Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C.Journal of Electronic Materials,48(7),4660-4668.
MLA	Sui, Ran,et al."Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C".Journal of Electronic Materials 48.7(2019):4660-4668.