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	Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文 Microelectronics Reliability, 2022, 卷号: 135 作者: Yu, Weiyuan; Li, Binbin; Wu, Baolei; Wang, Fengfeng; Wang, Mingkang 收藏 \| 浏览/下载：18/0 \| 提交时间：2022/08/09 Binary alloys Copper Copper alloys Indium alloys Lead-free solders Microstructure Shear flow Silicon carbide Soldering Temperature Thermoelectric equipment Wide band gap semiconductors Composite solders Electronics devices In-45cu composite solder paste Intermetallics compounds Microstructures and mechanical properties Service temperature Shears strength Solderpaste Ultrasonic action time Ultrasonic-assisted TLP
	Interfacial reactions at Ga-21.5In-10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions 期刊论文 MATERIALS CHEMISTRY AND PHYSICS, 2022, 卷号: 282, 页码: 16 作者: Gao, Zhaoqing; Wang, Chen; Chai, Zhenbang; Chen, Yinbo; Shen, Chenyu 收藏 \| 浏览/下载：24/0 \| 提交时间：2022/07/14 Intermetallics Microstructure Temperature gradient Preferred orientation Ga-21-5In-10Sn alloys Interfaces
	Wetting of substoichiometric YSZ2-x by molten Sn-based active alloys at 800–900 °C 期刊论文 Ceramics International, 2022, 卷号: 48, 期号: 20, 页码: 30621-30629 作者: Sui, Ran; Tan, Kaihui; Lin, Qiaoli; Xie, Kaibin 收藏 \| 浏览/下载：18/0 \| 提交时间：2022/08/09 Activation analysis Activation energy Binary alloys Bond strength (chemical) Brazing Diffusion bonding Phase interfaces Tin alloys Yttria stabilized zirconia Yttrium oxide Zircaloy Dissolutive wetting Interface formation Liquid/solid interface Metallicities Modified sessile drop method Non-metallic Soldering Titania Yttria-stabilized Zirconia substrates
	Wetting of YSZ by molten Sn-8Zr, Sn-4Zr-4Ti, and Sn-8Ti alloys at 800-900 degrees C 期刊论文 CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 1, 页码: 373-380 作者: Lin, Qiaoli; Tan, Kaihui; Wang, Le; Sui, Ran 收藏 \| 浏览/下载：20/0 \| 提交时间：2022/03/01 Wettability Soldering Spreading dynamics
	Comparative study on wetting of smooth and rough silica surface by molten Sn-3.5Ag-2Ti alloys 期刊论文 CERAMICS INTERNATIONAL, 2021, 卷号: 47, 期号: 20, 页码: 29205-29212 作者: Lin, Qiaoli; Wang, Chaopeng; Xie, Kaibin; Wang, Le; Sui, Ran 收藏 \| 浏览/下载：25/0 \| 提交时间：2021/10/14 Wettability Roughness Soldering Spreading dynamics
	Comparative study on wetting of smooth and rough silica surface by molten Sn–3.5Ag–2Ti alloys 期刊论文 Ceramics International, 2021, 卷号: 47, 期号: 20, 页码: 29205-29212 作者: Lin, Qiaoli; Wang, Chaopeng; Xie, Kaibin; Wang, Le; Sui, Ran 收藏 \| 浏览/下载：21/0 \| 提交时间：2022/02/17 Silica Soldering Wetting Comparatives studies Highest temperature Interfacial roughness Non linear Reactive wetting Rough surfaces Silica surface Sn-3.5Ag Spreading dynamics Wetting behavior
	Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 14, 页码: 11470-11481 作者: Cheng, Jinxuan; Hu, Xiaowu; Zhang, Zhe; Li, Qinglin 收藏 \| 浏览/下载：5/0 \| 提交时间：2020/11/14 Binary alloys Diffusion Growth rate Soldering Atomic diffusions Compound layer Diffusion channels Diffusion process Micro-structure evolutions Plating thickness Solder joint reliability Solder joints
	Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文 Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81 作者: Liu, Yun; Yu, Weiyuan; Sun, Xuemin; Wang, Fengfeng 收藏 \| 浏览/下载：8/0 \| 提交时间：2022/02/17 Binary alloys Dissolution Electronics packaging Energy dispersive spectroscopy Intermetallics Lead-free solders Morphology Needles Scanning electron microscopy Shear flow Soldered joints Soldering Tin Tin alloys Tin metallography Ultrasonic effects Ultrasonic waves Uranium metallography Vanadium metallography Design/methodology/approach Dispersion strengthening Energy dispersive X ray spectroscopy Fractured surfaces Grain morphologies Grooves Ultrasonic cavitation Ultrasonic vibration
	Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者: Yi, Xiong; Yi, Guangbin; Hu, Xiaowu; Li, Qinglin; Zhang, Ruhua 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/14 Atomic force microscopy Coatings Copper compounds Electroplating Gold Growth rate Lead-free solders Metallic films Scanning electron microscopy Semiconductor doping Silver alloys Silver metallography Soldering Substrates Surface roughness Ternary alloys Thermal aging Tin alloys Tin compounds Tin metallography X ray photoelectron spectroscopy Benzotriazole(BTA) Electroplated Cu films Heterocyclic compound Interfacial microstructure evolution Isothermal aging Kovar substrates Low concentrations Soldering process
	Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者: Yu, Weiyuan; Liu, Yingzong; Liu, Yun 收藏 \| 浏览/下载：5/0 \| 提交时间：2022/02/17 Binary alloys Copper compounds Interface states Intermetallics Lead-free solders Microstructure Phase interfaces Soldering Tin compounds Ultrasonic effects Unmanned aerial vehicles (UAV) Formation and evolutions Growth patterns IMC layer Interfacial intermetallics Liquid interface Nonequilibrium state Ultrasonic vibration

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