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	Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文 Microelectronics Reliability, 2022, 卷号: 135 作者: Yu, Weiyuan; Li, Binbin; Wu, Baolei; Wang, Fengfeng; Wang, Mingkang 收藏 \| 浏览/下载：18/0 \| 提交时间：2022/08/09 Binary alloys Copper Copper alloys Indium alloys Lead-free solders Microstructure Shear flow Silicon carbide Soldering Temperature Thermoelectric equipment Wide band gap semiconductors Composite solders Electronics devices In-45cu composite solder paste Intermetallics compounds Microstructures and mechanical properties Service temperature Shears strength Solderpaste Ultrasonic action time Ultrasonic-assisted TLP
	Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文 Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81 作者: Liu, Yun; Yu, Weiyuan; Sun, Xuemin; Wang, Fengfeng 收藏 \| 浏览/下载：9/0 \| 提交时间：2022/02/17 Binary alloys Dissolution Electronics packaging Energy dispersive spectroscopy Intermetallics Lead-free solders Morphology Needles Scanning electron microscopy Shear flow Soldered joints Soldering Tin Tin alloys Tin metallography Ultrasonic effects Ultrasonic waves Uranium metallography Vanadium metallography Design/methodology/approach Dispersion strengthening Energy dispersive X ray spectroscopy Fractured surfaces Grain morphologies Grooves Ultrasonic cavitation Ultrasonic vibration
	Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390 作者: Zhang, Qingke; Hu, Fangqin; Song, Zhenlun 收藏 \| 浏览/下载：114/0 \| 提交时间：2020/12/16 LEAD-FREE SOLDERS INTERMETALLIC COMPOUNDS LIQUID SN KINETICS GROWTH CU6SN5 METALLIZATION
	Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者: Yi, Xiong; Yi, Guangbin; Hu, Xiaowu; Li, Qinglin; Zhang, Ruhua 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/14 Atomic force microscopy Coatings Copper compounds Electroplating Gold Growth rate Lead-free solders Metallic films Scanning electron microscopy Semiconductor doping Silver alloys Silver metallography Soldering Substrates Surface roughness Ternary alloys Thermal aging Tin alloys Tin compounds Tin metallography X ray photoelectron spectroscopy Benzotriazole(BTA) Electroplated Cu films Heterocyclic compound Interfacial microstructure evolution Isothermal aging Kovar substrates Low concentrations Soldering process
	Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者: Yu, Weiyuan; Liu, Yingzong; Liu, Yun 收藏 \| 浏览/下载：5/0 \| 提交时间：2022/02/17 Binary alloys Copper compounds Interface states Intermetallics Lead-free solders Microstructure Phase interfaces Soldering Tin compounds Ultrasonic effects Unmanned aerial vehicles (UAV) Formation and evolutions Growth patterns IMC layer Interfacial intermetallics Liquid interface Nonequilibrium state Ultrasonic vibration
	Wetting of amorphous and partial crystalline Co73Si10B17 by Sn and Sn-based lead-free solders 期刊论文 MICROELECTRONICS RELIABILITY, 2019, 卷号: 98, 页码: 112-118 作者: Lin, Qiaoli; Ye, Changsheng; Sui, Ran; Ci, Wenjuan 收藏 \| 浏览/下载：12/0 \| 提交时间：2019/11/15 Wettability Oxide film Intermetallics Joining
	Formation and evolution of IMCs layer at Cu/Sn solid-liquid interface by ultrasonic assisted soldering 期刊论文 Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2019, 卷号: 29, 期号: 4, 页码: 764-771 作者: Yu, Wei-Yuan; Liu, Ying-Zong; Wu, Wei-Jie; Li, Fu-Xiang; Xing, Chun-Xiao 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/14 Binary alloys Brazing Copper compounds Diffusion Dissolution Intermetallics Lead-free solders Phase interfaces Tin alloys Tin compounds Cu-Sn intermetallics Dissolution model Evolution of the microstructure Formation and evolutions Formation mechanism Planar shape Soldering process Solid-liquid interfaces
	Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887 作者: Shang, Shengyan; Kunwar, Anil; Wang, Yanfeng; Qu, Lin; Ma, Haitao 收藏 \| 浏览/下载：26/0 \| 提交时间：2019/12/02 Binary alloys Copper alloys Film thickness Intermetallics Lead-free solders Molluscs Ostwald ripening Soldering Tin alloys, Cooling rates Furnace cooling Grain diameter Growth behavior Growth behaviour Layer thickness Non-uniformities Reflow temperatures, Cooling
	Wetting of Sn/Cu and Sn/Cu-Sn IMCs at 623–723K 期刊论文 Journal of Alloys and Compounds, 2018, 卷号: 767, 页码: 877-882 作者: Lin, Qiaoli; Li, Fuxiang; Wang, Jianbin 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/14 Copper oxides Gold Intermetallics Joining Lead-free solders Oxide films Oxide minerals Soldering Substrates Tin Cu intermetallics Driving forces Key factors Lead-Free Metallic substrate Precipitation reaction Sessile drop method Thin oxide films
	Wetting of Sn/Cu and Sn/Cu-Sn IMCs at 623-723K 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 767, 页码: 877-882 作者: Lin, Qiaoli; Li, Fuxiang; Wang, Jianbin 收藏 \| 浏览/下载：25/0 \| 提交时间：2019/11/15 Wettability Soldering Joining Lead-free Intermetallics

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