Wetting of Sn/Cu and Sn/Cu-Sn IMCs at 623–723K

doi:10.1016/j.jallcom.2018.07.201

	Wetting of Sn/Cu and Sn/Cu-Sn IMCs at 623–723K
	Lin, Qiaoli; Li, Fuxiang; Wang, Jianbin
刊名	Journal of Alloys and Compounds
	2018-10-30
卷号	767 页码:877-882
关键词	Copper oxides Gold Intermetallics Joining Lead-free solders Oxide films Oxide minerals Soldering Substrates Tin Cu intermetallics Driving forces Key factors Lead-Free Metallic substrate Precipitation reaction Sessile drop method Thin oxide films
ISSN号	09258388
DOI	10.1016/j.jallcom.2018.07.201
英文摘要	Wetting of Cu and Sn-Cu intermetallics (IMCs) by molten Sn is the basic process for soldering, and it was studied by using the sessile drop method under high vacuum in this work. The IMCs substrates with a thin Au coating have better wettability than Sn/Cu system for all experimental temperatures. The oxide film on the surface of the metallic substrate is the key factor for wetting. Using the thin passivation Au film can be a method to enhance the wettability and control the thickness of the IMC layer. The precipitation reaction of IMC may be a driving force for spreading. However, when the substrate is without the effect of the oxide film, the precipitation of the IMC layer would never be a driving force for spreading due to the good intrinsic wettability of Sn/Cu. When the substrate is covered by a thin oxide film, the reaction of Sn with Cu2O (both of Sn/Cu system and Sn/IMCs system) can be a driving force for spreading. © 2018 Elsevier B.V.
WOS研究方向	Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering
语种	英语
出版者	Elsevier Ltd
WOS记录号	WOS:000446316500105
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/114089]
专题	材料科学与工程学院
作者单位	State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metal, Lanzhou University of Technology, No. 287 Langongping Road, Lanzhou; 730050, China
推荐引用方式 GB/T 7714	Lin, Qiaoli,Li, Fuxiang,Wang, Jianbin. Wetting of Sn/Cu and Sn/Cu-Sn IMCs at 623–723K[J]. Journal of Alloys and Compounds,2018,767:877-882.
APA	Lin, Qiaoli,Li, Fuxiang,&Wang, Jianbin.(2018).Wetting of Sn/Cu and Sn/Cu-Sn IMCs at 623–723K.Journal of Alloys and Compounds,767,877-882.
MLA	Lin, Qiaoli,et al."Wetting of Sn/Cu and Sn/Cu-Sn IMCs at 623–723K".Journal of Alloys and Compounds 767(2018):877-882.