CORC

在结果中检索

CORC

浏览/检索结果: 共315条，第1-10条 帮助

已选(0)清除 条数/页：   排序方式：
Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20
作者:  Zhang, Sinan;  Wang Z(王臻);  Wang, Jie;  Duan GH(段桂花);  Li, Haixia
收藏  |  浏览/下载：20/0  |  提交时间：2022/08/22
Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：10/0  |  提交时间：2022/07/01
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid-liquid electromigration 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：17/0  |  提交时间：2021/10/14
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：12/0  |  提交时间：2022/02/17
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
作者:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：12/0  |  提交时间：2021/03/15
Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs 期刊论文
Vacuum, 2020, 卷号: 180
作者:  Qiu, Hongyu;  Hu, Xiaowu;  Li, Shuang;  Wan, Yongqiang;  Li, Qinglin
收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14
Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 51, 页码: 40-53
作者:  Wang, Mingna;  Qiao, Chuang;  Jiang, Xiaolin;  Hao, Long;  Liu, Xiahe
收藏  |  浏览/下载：12/0  |  提交时间：2021/02/02
Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 51, 页码: 40-53
作者:  Wang, Mingna;  Qiao, Chuang;  Jiang, Xiaolin;  Hao, Long;  Liu, Xiahe
收藏  |  浏览/下载：18/0  |  提交时间：2021/02/02
Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders 期刊论文
Microelectronics Reliability, 2020, 卷号: 111
作者:  Lin, Qiaoli;  Ye, Changsheng;  Sui, Ran
收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14
Wettability of amorphous and crystalline Co73Si10B17 by lead-free solders 期刊论文
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2020, 卷号: 30, 期号: 6, 页码: 1329-1337
作者:  Ye, Chang-Sheng;  Ci, Wen-Juan;  Lin, Qiao-Li;  Sui, Ran;  Wang, Jian-Bin
收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14

©版权所有 ©2017 CSpace - Powered by CSpace