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Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces
期刊论文
SURFACES AND INTERFACES, 2022, 卷号: 30, 页码: 12
作者:
Gao, Zhaoqing
;
Wang, Chen
;
Gao, Nan
;
Guo, Shihao
;
Chen, Yinbo
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2022/07/01
Ni-W-graphene coatings
Interfacial reaction barrier
CuGa 2 layer
Ga-21
5In-10Sn liquid alloys
Ni -W solid solution
Interfacial reactions at Ga-21.5In-10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions
期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2022, 卷号: 282, 页码: 16
作者:
Gao, Zhaoqing
;
Wang, Chen
;
Chai, Zhenbang
;
Chen, Yinbo
;
Shen, Chenyu
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2022/07/14
Intermetallics
Microstructure
Temperature gradient
Preferred orientation
Ga-21-5In-10Sn alloys
Interfaces
Insight into the effect of reorganized chemical short-range orders at Ga-based alloys/Cu interfaces on the nucleation and growth of CuGa2 crystals
期刊论文
MATERIALS LETTERS, 2022, 卷号: 307, 页码: 4
作者:
Gao, Zhaoqing
;
Chen, Yinbo
;
Wang, Chen
;
Yao, Kai
;
Chai, Zhenbang
收藏
  |  
浏览/下载:62/0
  |  
提交时间:2021/12/09
Crystal growth
Electronic materials
Intermetallic alloys and compounds
Ga-based alloys
Chemical short-range order
Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint
期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:
Chen, Yinbo
;
Gao, Zhaoqing
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2022/07/01
Sn-Bi-Ag solder
Grain orientation
Temperature gradient
Aging
Ag3Sn
Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11
作者:
Chen, Yinbo
;
Wang, Changchang
;
Gao, Yue
;
Gao, Zhaoqing
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2022/01/27
Insight into the interatomic competitive mechanism for interfacial stability of room temperature liquid GaInSn/Cu electrode
期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2021, 卷号: 270, 页码: 14
作者:
Gao, Zhaoqing
;
Chen, Yinbo
;
Dong, Chong
;
Chen, Fei
;
Huang, Mingliang
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  |  
浏览/下载:59/0
  |  
提交时间:2021/10/15
Liquid GaInSn alloys
Interfacial stability
Interatomic affinity
Competitive reactive mechanism
Gibbs free energy change
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
作者:
Chen, Yinbo
;
Meng, Zhi-Chao
;
Gao, Li-Yin
;
Liu, Zhi-Quan
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  |  
浏览/下载:12/0
  |  
提交时间:2021/03/15
Low temperature engineering feasibility of high reflective Ag-Sn films from experimental and thermodynamic views
期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2020, 卷号: 254, 页码: 7
作者:
Gao, Zhaoqing
;
Sun, Hao
;
Cao, Jinwei
;
Wang, Chen
;
Hussain, Muhammad Muzammal
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  |  
浏览/下载:45/0
  |  
提交时间:2021/02/02
Ag/sn reflective film
Nucleation thermodynamics
Ag4Sn
X-ray quantitative analysis
Synchrotron radiation
Low temperature engineering feasibility of high reflective Ag-Sn films from experimental and thermodynamic views
期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2020, 卷号: 254, 页码: 7
作者:
Gao, Zhaoqing
;
Sun, Hao
;
Cao, Jinwei
;
Wang, Chen
;
Hussain, Muhammad Muzammal
收藏
  |  
浏览/下载:49/0
  |  
提交时间:2021/02/02
Ag/sn reflective film
Nucleation thermodynamics
Ag4Sn
X-ray quantitative analysis
Synchrotron radiation
Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging
期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2020, 卷号: 33, 期号: 10, 页码: 9
作者:
Wang, Changchang
;
Chen, Yinbo
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2021/02/02
Cu-Sn IMC
Growth behavior
External stress effect
Isothermal aging
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