QQ客服 官方微博 反馈留言

浏览/检索结果: 共7条，第1-7条 帮助 限定条件 专题：兰州理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文 Microelectronics Reliability, 2022, 卷号: 135 作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang 收藏  |  浏览/下载：18/0  |  提交时间：2022/08/09 Binary alloys  Copper  Copper alloys  Indium alloys  Lead-free solders  Microstructure  Shear flow  Silicon carbide  Soldering  Temperature  Thermoelectric equipment  Wide band gap semiconductors  Composite solders  Electronics devices  In-45cu composite solder paste  Intermetallics compounds  Microstructures and mechanical properties  Service temperature  Shears strength  Solderpaste  Ultrasonic action time  Ultrasonic-assisted TLP   Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun 收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17 Binary alloys  Copper compounds  Interface states  Intermetallics  Lead-free solders  Microstructure  Phase interfaces  Soldering  Tin compounds  Ultrasonic effects  Unmanned aerial vehicles (UAV)  Formation and evolutions  Growth patterns  IMC layer  Interfacial intermetallics  Liquid interface  Nonequilibrium state  Ultrasonic vibration   Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun 收藏  |  浏览/下载：2/0  |  提交时间：2019/11/15 Ultrasonic-assisted soldering  interfacial intermetallic compounds  microstructure  tin solder   Microstructure of Ultrasonic-assisted Soldering Mg/Al Dissimilar Metal Joints 期刊论文 RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 10, 页码: 3197-3202 作者:  Yu Weiyuan;  Gao Mengzhao;  Zhang Tianyu;  Shang Jiangxu;  Yan Zehua 收藏  |  浏览/下载：0/0  |  提交时间：2019/11/15 Mg alloy  Al alloy  soldering  ultrasonic-assisted   Microstructure of Ultrasonic-assisted Soldering Mg/Al Dissimilar Metal Joints 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2018, 卷号: 47, 期号: 10, 页码: 3197-3202 作者:  Yu, Weiyuan;  Gao, Mengzhao;  Zhang, Tianyu;  Shang, Jiangxu;  Yan, Zehua 收藏  |  浏览/下载：3/0  |  提交时间：2022/02/17 Aluminum alloys  Aluminum compounds  Aluminum metallography  Binary alloys  Fillers  Grain boundaries  Intermetallics  Magnesium alloys  Magnesium compounds  Magnesium metallography  Metals  Microstructure  Silver metallography  Soldering alloys  Ternary alloys  Tin alloys  Tin metallography  Zinc alloys  Zinc metallography  6063 Al alloy  Al-alloy  Al-Sn-Zn  Dissimilar metal joints  Large amounts  Low melting point  Mg alloy  Second phase   Dispersion of Nano-Silver in Aqueous Media and Its Antibacterial Properties 期刊论文 RARE METAL MATERIALS AND ENGINEERING, 2010, 卷号: 39, 期号: 8, 页码: 1492-1495 作者:  Fang Mingfeng;  Wang Qingning;  Yang Mingjun;  Zhang Feilong;  Zhang Lei 收藏  |  浏览/下载：8/0  |  提交时间：2019/11/15 nano-silver  dispersion  minimal inhibitory concentration   Dispersion of nano-silver in aqueous media and its antibacterial properties 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2010, 卷号: 39, 期号: 8, 页码: 1492-1495 作者:  Fang, Mingfeng;  Wang, Qingning;  Yang, Mingjun;  Zhang, Feilong;  Zhang, Lei 收藏  |  浏览/下载：7/0  |  提交时间：2020/11/14 Bacteria  Dispersion (waves)  Nanoparticles  Silicates  Silver nanoparticles  Antibacterial properties  Dispersion condition  Electrostatic energies  Minimal inhibitory concentration  Minimum inhibitory concentration  Nano silver  Staphylococcus aureus  Ultrasound action