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	Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文 Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348 作者: Qiu, Hongyu; Xu, Han; Zhang, Chuge; Hu, Xiaowu; Jiang, Xiongxin 收藏 \| 浏览/下载：12/0 \| 提交时间：2022/02/17 Binary alloys Copper alloys Electromigration Tensile strength Tin alloys Bonding joints Co content Coaddition Current direction Electric density Micro-structure evolutions Solder joints
	Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs 期刊论文 Vacuum, 2020, 卷号: 180 作者: Qiu, Hongyu; Hu, Xiaowu; Li, Shuang; Wan, Yongqiang; Li, Qinglin 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/11/14 Binary alloys Copper alloys Elastic moduli Fracture Fracture mechanics Shear flow Soldered joints Surface analysis Tin alloys Area ratios Fracture mechanisms Fracture surface analysis Fracture surfaces Fractured surfaces Isothermal aging Lead-free solder joint Solder joints
	Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者: Yu, Weiyuan; Liu, Yingzong; Liu, Yun 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/11/15 Ultrasonic-assisted soldering interfacial intermetallic compounds microstructure tin solder
	Effects of aluminum addition (x = 0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文 Materials Research Express, 2019, 卷号: 6, 期号: 8 作者: Li, Jiayin; Hu, Xiaowu; Zhang, Xudong; Li, Qinglin 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/14 Aluminum Binary alloys Ductile fracture Eutectics Fracture mechanics Lead-free solders Mechanical properties Microstructure Tensile strength Ternary alloys Tin alloys Eutectic structures Fracture analysis Lead-free solder alloy Microstructure and mechanical properties Microstructure refinement Peritectic reaction Ultimate tensile strength Zn-Sn alloys
	Effect of flux doped with Cu6Sn5 nanoparticles on the interfacial reaction of lead-free solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 12, 页码: 11552-11562 作者: Wang, Haozhong; Hu, Xiaowu; Li, Qinglin; Qu, Min 收藏 \| 浏览/下载：5/0 \| 提交时间：2019/11/15 Binary alloys Coarsening Copper Growth rate Morphology Nanoparticles Rate constants Soldered joints Tin alloys Aging time Cu substrate IMC layer Inhibition effect Isothermal aging Lead-free solder joint Nanoparticle (NPs) Solder joints
	Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420 作者: Zhang, Xudong; Hu, Xiaowu; Jiang, Xiongxin; Li, Qinglin; Zhou, Liuru 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/14 Binary alloys Geometry Intermetallics Lead-free solders Morphology Polychlorinated biphenyls Silver compounds Soldered joints Tin alloys Aging time Compressive strain Enhanced effects Growth of intermetallics Kirkendall void Mean diameter Polyhedron shapes Solder joints
	Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369 作者: Huang, Ru; Ma, Haoran; Shang, Shengyan; Kunwar, Anil; Wang, Yunpeng 收藏 \| 浏览/下载：26/0 \| 提交时间：2019/12/02 Chip scale packages Copper Copper alloys Flip chip devices Grain boundaries Growth rate Size determination Soldered joints Substrates Tin alloys, Electronic product Grain boundary motions Interface reactions Lateral growth rates Longitudinal growth Packaging process Packaging technologies Solder composition, Soldering
	Interfacial microstructure evolution of gold alloy/Sn-based solder under different thermal aging conditions 会议论文 2ND INTERNATIONAL WORKSHOP ON MATERIALS SCIENCE AND MECHANICAL ENGINEERING (IWMSME2018), 2019-01-01 作者: Mu, G. Q.; Qu, W. Q.; Wu, Y. C.; Zhuang, H. S. 收藏 \| 浏览/下载：64/0 \| 提交时间：2019/12/30 Binary alloys Hardness Mechanical properties Microstructure Soldering Ternary alloys Thermal aging Tin alloys Aging conditions Aging temperatures Fracture feature Interfacial compounds Interfacial microstructure evolution Sn-based solders Solder interfaces Thermal aging tests Gold alloys
	Spreading of Sn-Ag-Ti and Sn-Ag-Ti(-Al) solder droplets on the surface of porous graphite through ultrasonic vibration 期刊论文 Materials and Design, 2018, 卷号: 150, 页码: 9-16 作者: Yu, Weiyuan; Liu, Yun; Liu, Xinya 收藏 \| 浏览/下载：5/0 \| 提交时间：2022/02/17 Aluminum alloys Drops Graphite High speed cameras Oxide films Silver alloys Soldering Temperature Ternary alloys Tin alloys Titanium alloys Transmissions Ultrasonic effects Ultrasonic waves Vibration analysis Wave transmission Active solder Atmospheric conditions Spreading Spreading characteristics Spreading distances Ultrasonic amplitude Ultrasonic attenuation Ultrasonic vibration
	Interface reaction in ultrasonic vibration-assisted brazing of aluminum to graphite using Sn-Ag-Ti solder foil 期刊论文 Journal of Materials Processing Technology, 2015, 卷号: 221, 页码: 285-290 作者: Yu, Wei-Yuan; Liu, Sen-Hui; Liu, Xin-Ya; Liu, Min-Pen; Shi, Wei-Gang 收藏 \| 浏览/下载：0/0 \| 提交时间：2022/02/17 Aluminum Atoms Brazing Graphite Lead-free solders Phase interfaces Silver alloys Surface tension Ternary alloys Tin alloys Titanium Titanium alloys Ultrasonic effects Ultrasonic waves Active solder Atmospheric conditions Brazing temperature Formation mechanism Interaction Interface reactions Substitutional solid solutions Ultrasonic vibration

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